Company Filing History:
Years Active: 2020-2021
Title: Hisashi Arakida: Innovator in Cutting and Wafer Processing Technologies
Introduction
Hisashi Arakida is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of cutting and wafer processing technologies. With a total of 2 patents to his name, Arakida continues to push the boundaries of innovation in his industry.
Latest Patents
Hisashi Arakida's latest patents include a cutting apparatus and a wafer processing method. The cutting apparatus features a cutting unit designed to cut a workpiece within a frame unit. It also includes an ultraviolet ray irradiation unit that irradiates the frame unit with ultraviolet rays. The control unit of the apparatus has a processing mode registration section that allows for the registration of commands in both cutting and ultraviolet ray irradiation modes.
The wafer processing method focuses on processing a wafer that has devices on its front side. This method includes a back grinding step that forms a recess and an annular reinforcing portion on the back side of the wafer. Additionally, a dividing step is involved, which cuts the wafer along pre-formed division lines on the front side. The back grinding step creates a taper surface that is inclined with respect to the bottom surface of the recess, enhancing the overall efficiency of the process.
Career Highlights
Hisashi Arakida is currently employed at Disco Corporation, where he applies his expertise in developing advanced cutting and wafer processing technologies. His work has been instrumental in improving manufacturing processes and enhancing product quality in the semiconductor industry.
Collaborations
Throughout his career, Arakida has collaborated with notable colleagues, including Hiroyuki Hiraga and Katsuhiko Suzuki. These partnerships have fostered innovation and contributed to the success of various projects within the company.
Conclusion
Hisashi Arakida stands out as a key figure in the realm of cutting and wafer processing technologies. His innovative patents and contributions to Disco Corporation highlight his commitment to advancing the industry. His work continues to inspire future developments in technology.