logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10629445 B1

PDFFull Text
Date of Patent:
Apr. 21, 2020

Filed:

Jun. 27, 2018

Wafer processing method

Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Katsuhiko Suzuki, Tokyo, JP;

Hisashi Arakida, Tokyo, JP;

Tomoaki Sugiyama, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:

Greer Burns & Crain Ltd.

Primary Examiner:

Nicholas J Tobergte

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/304 (2006.01); H01L 21/77 (2017.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); B28D 5/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/304 (2013.01); H01L 21/6836 (2013.01); H01L 21/77 (2013.01); H01L 21/78 (2013.01); B28D 5/022 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01);
Abstract

A wafer processing method for processing a wafer having devices on the front side is provided. The wafer processing method includes a back grinding step of grinding the wafer to form a recess and an annular reinforcing portion surrounding the recess on the back side of the wafer, and a dividing step of cutting the wafer along division lines formed on the front side of the wafer. In the back grinding step, a taper surface is formed between the bottom surface of the recess and the annular reinforcing portion. The taper surface is inclined with respect to a direction perpendicular to the bottom surface of the recess. In the dividing step, a cutting blade is lowered to start cutting at a position radially inside the outer circumference of the wafer and is subsequently raised to stop cutting at another position radially inside the outer circumference of the wafer.

Find Patent Forward Citations

Loading…