Saitama, Japan

Hisao Ishida


Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 23(Granted Patents)


Location History:

  • Tokorozawa, JP (1992)
  • Saitama, JP (1989 - 1993)

Company Filing History:


Years Active: 1989-1993

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4 patents (USPTO):Explore Patents

Title: Hisao Ishida: Innovator in Bonding Technology

Introduction

Hisao Ishida is a prominent inventor based in Saitama, Japan. He has made significant contributions to the field of bonding technology, holding a total of 4 patents. His innovative designs have improved the efficiency and effectiveness of bonding processes in various applications.

Latest Patents

His latest patents include a bonder tool cleaning mechanism and a tape bonding apparatus. The bonder tool cleaning mechanism features a coarse grindstone, a finishing grindstone, and a wire brush on a cleaning section. When the bonding tool is moved above the cleaning section and lowered to contact the grindstones and brush, the cleaning section oscillates horizontally, ensuring thorough cleaning of the bonding tool. The tape bonding apparatus includes a bonding guide for directing a tab tape with leads to a bonding position. It features a clamper that presses the tab tape against the bonding guide, a pellet stage beneath the clamper, and a vertically movable bonding tool above the bonding guide. The design prevents damage to the leads by ensuring that the holes in the clamper and bonding guide are shaped to match the opening of the tape.

Career Highlights

Hisao Ishida is associated with Kabushiki Kaisha Shinkawa, where he has been instrumental in developing advanced bonding technologies. His work has been recognized for its innovative approach and practical applications in the industry.

Collaborations

Throughout his career, Ishida has collaborated with notable colleagues, including Akihiro Nishimura and Koji Sato. Their combined expertise has contributed to the success of various projects and innovations in bonding technology.

Conclusion

Hisao Ishida's contributions to bonding technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in bonding processes, showcasing the importance of innovation in technology.

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