The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 1989
Filed:
Jan. 26, 1989
Yasunobu Suzuki, Tokyo, JP;
Motohiko Kato, Tokyo, JP;
Akio Bando, Tokyo, JP;
Hisao Ishida, Saitama, JP;
Akihiro Nishimura, Tokyo, JP;
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Abstract
An apparatus for connecting or bonding leads of solid-state devices to lead frames, etc. in which a solid-state device punched out of a film carrier by a punch is first picked up and held by a suction-adhesion head. A raising and lowering arm is then driven longitudinally and laterally so that the suction-adhesion head with the solid-state device thereon is moved to a position over a first bonding station. Then, the raising and lowering arm is lowered via a vertical driving mechanism, and the solid-state device held by the suction-adhesion head is pressed against a specified lead frame. A first bonding tool is lowered and simultaneously bonds the leads on two opposite sides of the solid-state device to the lead frame. Then, the first bonding tool is raised, and the suction-adhesion head is raised and moves back to a position over the punch. The lead frame to which two sides of the solid-state device have been thus bonded is fed, and at a second bonding position, the leads on the other two opposite sides of the solid-state device are bonded to the lead frame by a second bonding tool.