Kabushiki Kaisha Shinkawa

Hisao Ishida

Koji Sato

Akihiro Nishimura

Yasunobu Suzuki

Motohiko Kato

Akio Bando

In a bonder tool cleaning mechanism in a bonding machine, a coarse grindstone, a finishing grindstone and a wire brush are provided on a cleaning section, and when a bonding tool is moved above the cleaning section and then moved down to come into contact with the grindstones and brush, the cleaning section oscillates horizontally so that grindstones and brush clean the bonding tool.

Bonder tool cleaning mechanism

A tape bonding apparatus including a bonding guide for guiding a tab tape, which has leads, to a bonding position, a clamper located under the bonding guide for pressing the tab tape against the bonding guide, a pellet stage provided beneath the clamper, and a vertically movable bonding tool located above the bonding guide, in which a hole formed in the clamper is larger than opening of the tab tape, and the holes formed in the bonding guide and clamper are about the same in shape as the opening of the tape so as to prevent the leads set on the tab tape from coming into contact with the clamper, thus avoiding any damage to the leads. Also, the bonding guide is flat near the bonding position, and the pellet stage is smaller than the window of the clamper.

Tape bonding apparatus

A method and apparatus for bonding external leads of a solid state device to a lead frame, where a positional discrepancy between the solid state device and the lead frame is corrected not only in X-Y directions but also in the rotational direction so as to perform a high accuracy bonding. Discrepancies in the rotational direction are calculated after detecting two points of the solid-state device, and a sunction head holding such solid-state device is rotated to correct such discrepancy. One portion of the solid-state device is further detected and the discrepancy in X-Y direction is calculated so as to correct the relative positional discrepancy of the solid-state device and the lead frame.

Method and apparatus for bonding external leads

An apparatus for connecting or bonding leads of solid-state devices to lead frames, etc. in which a solid-state device punched out of a film carrier by a punch is first picked up and held by a suction-adhesion head. A raising and lowering arm is then driven longitudinally and laterally so that the suction-adhesion head with the solid-state device thereon is moved to a position over a first bonding station. Then, the raising and lowering arm is lowered via a vertical driving mechanism, and the solid-state device held by the suction-adhesion head is pressed against a specified lead frame. A first bonding tool is lowered and simultaneously bonds the leads on two opposite sides of the solid-state device to the lead frame. Then, the first bonding tool is raised, and the suction-adhesion head is raised and moves back to a position over the punch. The lead frame to which two sides of the solid-state device have been thus bonded is fed, and at a second bonding position, the leads on the other two opposite sides of the solid-state device are bonded to the lead frame by a second bonding tool.

Growing community of inventors

Saitama, Japan

Hisao Ishida