Kanagawa, Japan

Hiroyuki Osawa


Average Co-Inventor Count = 4.0

ph-index = 6

Forward Citations = 134(Granted Patents)


Location History:

  • Kanagawa, JP (2001 - 2006)
  • Kawasaki, JP (2001 - 2006)

Company Filing History:


Years Active: 2001-2006

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8 patents (USPTO):Explore Patents

Title: Hiroyuki Osawa: Innovator in Semiconductor Polishing Technology

Introduction

Hiroyuki Osawa is a prominent inventor based in Kanagawa, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the development of polishing apparatuses. With a total of 8 patents to his name, Osawa's innovations have played a crucial role in enhancing the efficiency and precision of semiconductor wafer polishing.

Latest Patents

Osawa's latest patents include advanced polishing apparatuses designed for semiconductor wafers. One notable invention pertains to a polishing apparatus that features a storage section capable of receiving both the workpiece to be polished and the polished workpiece. This apparatus includes a primary polishing table and a secondary polishing table, with the unique design allowing a portion of the workpiece to extend beyond the edge of the secondary polishing table during the polishing process. Additionally, a film thickness measuring device is integrated to measure the thickness of the film formed on the polished workpiece while it is held by a top ring above a pusher. Another patent describes a polishing apparatus equipped with a sensor that continuously detects the thickness of an electrically conductive layer on the substrate. This apparatus includes a polishing table with a polishing surface and a top ring that holds and presses the substrate against the polishing surface for effective polishing.

Career Highlights

Hiroyuki Osawa has established himself as a key figure in the semiconductor industry through his work at Ebara Corporation. His innovative designs and patents have significantly advanced the technology used in semiconductor wafer polishing, making processes more efficient and reliable.

Collaborations

Osawa has collaborated with notable colleagues in his field, including Seiji Katsuoka and Manabu Tsujimura. These collaborations have further enriched his work and contributed to the development of cutting-edge technologies in semiconductor processing.

Conclusion

Hiroyuki Osawa's contributions to semiconductor polishing technology through his patents and collaborations highlight his importance as an inventor in this field. His work continues to influence the efficiency and effectiveness of semiconductor manufacturing processes.

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