The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2006
Filed:
Jun. 10, 2005
Seiji Katsuoka, Kanagawa, JP;
Manabu Tsujimura, Kanagawa, JP;
Kunihiko Sakurai, Kanagawa, JP;
Hiroyuki Osawa, Kanagawa, JP;
Seiji Katsuoka, Kanagawa, JP;
Manabu Tsujimura, Kanagawa, JP;
Kunihiko Sakurai, Kanagawa, JP;
Hiroyuki Osawa, Kanagawa, JP;
Ebara Corporation, Tokyo, JP;
Abstract
This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein the polishing surface of the secondary polishing table is constructed to be arranged such that at least a portion of a surface of the workpiece being polished by the polishing surface of the secondary polishing table extends beyond an edge of the polishing surface of the secondary polishing table. Also provided is a film thickness measuring device, which measures the thickness of a film formed on a polished workpiece while the polished workpiece is held by a top ring above a pusher.