The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2006
Filed:
Jun. 10, 2004
Norio Kimura, Fujisawa, JP;
Hideji Isobe, Chigasaki, JP;
Kazuo Shimizu, Yokohama, JP;
Hiroyuki Osawa, Kawasaki, JP;
Norio Kimura, Fujisawa, JP;
Hideji Isobe, Chigasaki, JP;
Kazuo Shimizu, Yokohama, JP;
Hiroyuki Osawa, Kawasaki, JP;
Ebara Corporation, Tokyo, JP;
Abstract
A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.