This inventor holds 4 USPTO granted patents and 1 EPO patent. Top assignees: Mitsubishi Hitachi Power Systems, Ltd., Sony Corporation. Active years: 2005-2017.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2005-2017
Title: Hiroyuki Ohyama: Innovator in High-Temperature Piping Technologies
Introduction
Hiroyuki Ohyama is a distinguished inventor based in Tokyo, Japan, recognized for his contributions to innovation in the field of high-temperature piping technologies. With a total of four patents to his name, his expertise has made significant advancements in maintaining and improving the lifespan of high-temperature piping systems.
Latest Patents
Ohyama's latest patents showcase his pioneering methods in extending the life expectancy of high-temperature piping. One notable innovation is a method that involves removing the heat insulation material that covers piping with a high creep rupture risk. This method aims to lower the outer surface temperature of the piping, emphasizing that the width of the exposed portion obtained should be twice or more the distance from the peeled-off end portion where compressive stress approaches zero. The calculations in this method are based on specific formulae, incorporating factors such as Poisson's ratio and plate thickness.
Another significant patent focuses on a damage evaluation method and maintenance evaluation index decision method. This innovation correlates a first measured value of a physical quantity at a target portion with a damage evaluation index to accurately calculate the degree of damage. By measuring this specific physical quantity at various time periods, the process allows for the development of a new damage evaluation index, providing a comprehensive approach to monitoring changes over time.
Career Highlights
Hiroyuki Ohyama has built his career working with leading companies, including Mitsubishi Hitachi Power Systems, Ltd. and Sony Corporation. His experiences in these organizations have contributed to his development as a prominent figure in engineering and innovation within high-temperature piping technologies.
Collaborations
Throughout his career, Ohyama has collaborated with esteemed professionals such as Kouji Komatsu and Seiichi Morikawa. Their collective expertise has undoubtedly enriched the development of technologies aimed at enhancing the safety and efficacy of piping systems across various industries.
Conclusion
Hiroyuki Ohyama's contributions to the field of high-temperature piping through his innovative patents demonstrate his commitment to improving engineering practices. His unique approaches to extending the life expectancy of piping systems not only reflect his ingenuity but also signify significant advancements in their safe maintenance. As he continues to work within the industry, his innovations are likely to have lasting impacts on the engineering landscape.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
