The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2017
Filed:
Jan. 15, 2015
Mitsubishi Hitachi Power Systems, Ltd., Kanagawa, JP;
Daigo Watanabe, Tokyo, JP;
Fumitoshi Sakata, Tokyo, JP;
Takumi Tokiyoshi, Tokyo, JP;
Yasuharu Chuman, Tokyo, JP;
Takuya Fukahori, Tokyo, JP;
Yuichi Kanemaki, Tokyo, JP;
Hiroyuki Ohyama, Tokyo, JP;
Shintaro Matsumoto, Tokyo, JP;
Masaaki Fujita, Tokyo, JP;
Ichiro Ohtsu, Tokyo, JP;
MITSUBISHI HITACHI POWER SYSTEMS, LTD., Kanagawa, JP;
Abstract
A method of extending a life expectancy of a high-temperature piping, includes removing a heat insulation material which covers the piping having a high creep rupture risk, and lowering an outer surface temperature of piping, wherein a width of an exposed portion obtained is twice or more a distance from a peeled-off end portion of the exposed portion to a portion where a compressive stress is asymptotical to 0 after a change in stress between a tensile stress and the compressive stress occurring in the piping due to the removal of the heat insulation material is made from the tensile stress to the compressive stress, and the distance is calculated based on the following formulae, βx=5, here, ν is a Poisson's ratio, a is an average radius of the piping, and h is a plate thickness of the piping.