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Years Active: 2021
Title: Hiroyuki Kontani: Innovator in Composite Materials
Introduction
Hiroyuki Kontani is a notable inventor based in Toyama, Japan. He has made significant contributions to the field of composite materials, particularly in the development of innovative substrates with unique properties. His work has implications for various applications, including semiconductor devices.
Latest Patents
Hiroyuki Kontani holds a patent for a composite member, heat radiation member, semiconductor device, and method of manufacturing a composite member. This patent describes a composite member that includes a substrate composed of a composite material containing both metal and non-metal components. One of the key features of this substrate is its spherical warpage, with a radius of curvature ranging from 5000 mm to 35000 mm. The sphericity error is defined as an average distance between multiple measurement points on the contour of the warped portion of the substrate, which should not exceed 10.0 micrometers. Additionally, the substrate boasts a thermal conductivity of at least 150 W/m·K and a coefficient of linear expansion not greater than 10 ppm/K.
Career Highlights
Throughout his career, Hiroyuki Kontani has worked with prominent companies, including Sumitomo Electric Industries, Limited and A.L.M.T. Corporation. His experience in these organizations has allowed him to refine his expertise in composite materials and their applications in technology.
Collaborations
Hiroyuki has collaborated with notable colleagues, including Isao Iwayama and Shigeki Koyama. These partnerships have contributed to the advancement of his research and innovations in the field.
Conclusion
Hiroyuki Kontani is a distinguished inventor whose work in composite materials has paved the way for advancements in semiconductor technology. His innovative patent reflects his commitment to enhancing material properties for practical applications.