The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2021

Filed:

Nov. 08, 2017
Applicants:

Sumitomo Electric Industries, Ltd., Osaka, JP;

A.l.m.t. Corp., Tokyo, JP;

Inventors:

Isao Iwayama, Osaka, JP;

Shigeki Koyama, Toyama, JP;

Masashi Okamoto, Toyama, JP;

Yuta Inoue, Toyama, JP;

Hiroyuki Kontani, Toyama, JP;

Takehisa Yamamoto, Toyama, JP;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/373 (2006.01); H05K 1/18 (2006.01); H05K 1/03 (2006.01); C22C 29/06 (2006.01); H05K 7/20 (2006.01); C22C 26/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); C22C 26/00 (2013.01); C22C 29/06 (2013.01); C22C 29/065 (2013.01); H01L 23/373 (2013.01); H05K 1/0204 (2013.01); H05K 1/0353 (2013.01); H05K 1/181 (2013.01); H05K 7/20 (2013.01); H05K 2201/10378 (2013.01);
Abstract

A composite member includes a substrate composed of a composite material containing a metal and a non-metal. One surface of the substrate has spherical warpage of which radius of curvature R is not smaller than 5000 mm and not greater than 35000 mm. A sphericity error is not greater than 10.0 μm, the sphericity error being defined as an average distance between a plurality of measurement points on a contour of a warped portion of the substrate and approximate arcs defined by the plurality of measurement points. The substrate has a thermal conductivity not lower than 150 W/m·K and a coefficient of linear expansion not greater than 10 ppm/K.


Find Patent Forward Citations

Loading…