Ibaraki, Japan

Hiroyuki Hanazono

USPTO Granted Patents = 13 

 

Average Co-Inventor Count = 3.2

ph-index = 2

Forward Citations = 19(Granted Patents)


Location History:

  • Osaka, JP (2013 - 2014)
  • Ibaraki, JP (2013 - 2018)

Company Filing History:


Years Active: 2013-2018

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13 patents (USPTO):Explore Patents

Title: The Innovative Mind of Hiroyuki Hanazono: Pioneering Semiconductor Technology

Introduction: Hiroyuki Hanazono, based in Ibaraki, Japan, is an accomplished inventor with a remarkable portfolio of 13 patents. His innovations primarily focus on enhancing semiconductor technology, showcasing his dedication to advancing this critical field.

Latest Patents: Among his latest patents are groundbreaking inventions such as the "Dicing-tape integrated film for the backside of semiconductor and method of manufacturing semiconductor device." This invention addresses the challenge of maintaining the peel strength between the dicing tape and the film for the backside of a flip-chip semiconductor when subjected to heat. The dicing-tape integrated film features a substrate, a pressure-sensitive adhesive layer, and a distinctive design that ensures minimal increase in peel strength during heating.

Another significant patent is for the "Underfill material, laminated sheet and method for producing semiconductor device." This innovation introduces an underfill material with impressive curing reactivity, specifically designed to maintain a stable viscosity and provide reliable electrical connections under thermal stress. The underfill material boasts precise viscosity characteristics and a high reaction rate, making it a vital advancement in semiconductor manufacturing.

Career Highlights: Hiroyuki Hanazono currently works at Nitto Denko Corporation, a well-respected organization in the field of advanced materials. His contributions in developing cutting-edge semiconductor solutions have positioned him as a key player in the industry.

Collaborations: Throughout his career, Hanazono has collaborated with esteemed colleagues such as Shinichi Inoue and Mineyoshi Hasegawa. These partnerships have fostered a creative environment that encourages innovation and excellence in semiconductor research and development.

Conclusion: Hiroyuki Hanazono exemplifies the spirit of innovation, continuously driving advancements in semiconductor technology through his patents and collaborative efforts. His work at Nitto Denko Corporation and the insights gained from his collaborations demonstrate a commitment to pushing the boundaries of what is possible in the semiconductor sector, securing his place as a prominent inventor in the industry.

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