Hiroyuki Fukai

Title: Hiroyuki Fukai: Innovator in Adhesive Film Technology

Introduction

Hiroyuki Fukai is a prominent inventor based in Shimodate, Japan. He has made significant contributions to the field of adhesive film technology, holding a total of 6 patents. His work focuses on enhancing the performance and manufacturing processes of multilayer printed wiring boards.

Latest Patents

Fukai's latest patents include innovative developments such as an adhesive film, a multilayer printed wiring board using adhesive film, and a method for manufacturing multilayer printed wiring boards. The adhesive film he developed consists of a resin composition layer for an interlayer insulating layer, a thermosetting resin composition layer, and a support film. This unique arrangement allows for improved adhesion strength and addresses challenges in laser processing and desmear removal processes. His method for preparing an insulating resin composition involves a combination of various materials, including novolak epoxy resin and carboxylic acid-modified acrylonitrile butadiene rubber particles, which contribute to the effectiveness of multilayer wiring boards.

Career Highlights

Throughout his career, Hiroyuki Fukai has worked with notable companies, including Hitachi Chemical Company, Ltd. His experience in these organizations has allowed him to refine his expertise in adhesive technologies and contribute to advancements in the industry.

Collaborations

Fukai has collaborated with esteemed colleagues such as Mineo Kawamoto and Tokihito Suwa. These partnerships have fostered innovation and the sharing of knowledge within the field.

Conclusion

Hiroyuki Fukai's contributions to adhesive film technology and multilayer printed wiring boards have established him as a key figure in the industry. His innovative patents and collaborative efforts continue to influence advancements in this critical area of technology.