The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2020
Filed:
Jul. 06, 2012
Masaharu Matsuura, Ibaraki, JP;
Nobuyuki Ogawa, Ibaraki, JP;
Hiroaki Fujita, Ibaraki, JP;
Hiroyuki Fukai, Ibaraki, JP;
Masaharu Matsuura, Ibaraki, JP;
Nobuyuki Ogawa, Ibaraki, JP;
Hiroaki Fujita, Ibaraki, JP;
Hiroyuki Fukai, Ibaraki, JP;
HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;
Abstract
An adhesive film according to the present invention includes a resin composition layer (layer A) for an interlayer insulating layer, a thermosetting resin composition layer (layer B), and a support film (layer C), and the layer C, the layer A, and the layer B are sequentially arranged in this order. The layer A is a resin composition which contains a thermosetting resin (a1) and an inorganic filler (b1) having a specific surface area of 20 m/g or more, and the mass ratio of the thermosetting resin (a1) to the inorganic filler (b1) is within the range from 30:1 to 2:1. The layer B contains a thermosetting resin composition which is in a solid state at a temperature lower than 40° C. but melts at a temperature of 40° C. or higher but lower than 140° C. Consequently, the adhesive film according to the present invention can solve problems in a laser process and a desmear removal process following the laser process and can form a conductor layer which has a high adhesion strength even on an interlayer insulating layer having a smooth surface-roughened state.