Tokyo, Japan

Hiroyoshi Deguchi

This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Resonac Corporation. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiroyoshi Deguchi. Retrieved from https://idiyas.com/inventor/hiroyoshi-deguchi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Hiroyoshi Deguchi: Innovator in Liquid Resin Technology

Introduction

Hiroyoshi Deguchi is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of electronic components through his innovative work in liquid resin compositions. His expertise and dedication to advancing technology have led to the development of a unique patent that addresses the needs of the electronics industry.

Latest Patents

Hiroyoshi Deguchi holds a patent for a liquid resin composition designed for sealing electronic component devices. This composition includes an epoxy resin, a curing agent with at least one amino group, a polymer resin with a weight average molecular weight of 10,000 or more, and an inorganic filler. This innovative formulation enhances the reliability and performance of electronic devices.

Career Highlights

Hiroyoshi Deguchi is currently employed at Resonac Corporation, where he continues to push the boundaries of material science. His work has not only contributed to the company's success but has also positioned him as a key figure in the development of advanced sealing technologies.

Collaborations

Hiroyoshi has collaborated with talented coworkers such as Yuma Takeuchi and Hisato Takahashi. Their combined efforts have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Hiroyoshi Deguchi's contributions to liquid resin technology exemplify the spirit of innovation in the electronics industry. His patent and ongoing work at Resonac Corporation highlight his commitment to advancing technology and improving electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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