The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2025
Filed:
May. 11, 2016
Applicant:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Inventors:
Assignee:
RESONAC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08G 59/50 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); C08L 53/00 (2006.01); C08L 67/02 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08G 59/50 (2013.01); C08G 59/5033 (2013.01); H01L 23/29 (2013.01); H01L 23/31 (2013.01); C08L 53/00 (2013.01); C08L 67/02 (2013.01); C08L 2203/20 (2013.01);
Abstract
A liquid resin composition for sealing contains an epoxy resin (A); a curing agent (B) containing at least one amino group in a molecule; a polymer resin (C); and an inorganic filler (D), wherein the polymer resin (C) has a weight average molecular weight of 10,000 or more.