Saitama, Japan

Hiroto Iida


 

Average Co-Inventor Count = 2.5

ph-index = 1

Forward Citations = 2(Granted Patents)


Location History:

  • Saitama, JP (2015 - 2016)
  • Ageo, JP (2024)

Company Filing History:


Years Active: 2015-2024

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4 patents (USPTO):Explore Patents

Title: Hiroto Iida: Innovator in Printed Wiring Board Manufacturing

Introduction

Hiroto Iida is a notable inventor based in Saitama, Japan. He has made significant contributions to the field of printed wiring board manufacturing, holding a total of 4 patents. His innovative methods have enhanced the efficiency and quality of circuit formation.

Latest Patents

Hiroto Iida's latest patents focus on methods for manufacturing printed wiring boards that effectively suppress pattern failure while excelling in fine circuit forming properties. One of his methods involves providing an insulating substrate with a roughened surface, followed by electroless plating to create a layer less than 1.0 μm thick. This layer features specific surface characteristics, including an arithmetic mean waviness Wa of 0.10 μm or more and 0.25 μm or less, as well as a valley portion void volume Vvv of 0.010 μm/μm or more and 0.028 μm/μm or less. The process continues with laminating a photoresist, exposure and development to form a resist pattern, electroplating, stripping the resist pattern, and etching away unnecessary portions to create a wiring pattern.

Career Highlights

Hiroto Iida is currently employed at Mitsui Mining & Smelting Company, Ltd., where he continues to innovate in the field of electronics manufacturing. His work has been instrumental in advancing the technology used in printed wiring boards, making them more reliable and efficient.

Collaborations

Hiroto collaborates with talented coworkers, including Yoshinori Shimizu and Misato Mizoguchi. Their combined expertise contributes to the success of their projects and the advancement of their field.

Conclusion

Hiroto Iida's contributions to printed wiring board manufacturing demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in circuit formation, positioning him as a key figure in the industry.

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