Company Filing History:

14 out of 27,375

Matsushita Electric Industrial Co., Ltd.

patents

3 out of 16,453

Panasonic Corporation

patents

Years Active: 2001-2010

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17 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7708848 - Component bonding method and component bonding device (2010-05-04),

2. 7653454 - Electronic parts installation device and cassette control device (2010-01-26),

3. 7458147 - Method for determining whether a component holder is defective (2008-12-02),

4. 7028390 - Electronic parts installation device and cassette control device (2006-04-18),

5. 7020956 - Method and apparatus for feeding components, and method and apparatus for mounting components (2006-04-04),

6. 7003872 - Electronic component mounting apparatus and method (2006-02-28),

7. 6948232 - Component recognizing method and apparatus, and component mounting method and apparatus (2005-09-27),

8. 6877220 - Method for feeding a component (2005-04-12),

9. 6868603 - Method of mounting component on circuit board (2005-03-22),

10. 6862803 - Method for mounting electronic component (2005-03-08),

11. 6785008 - Board for measuring offset of component mounting apparatus, and method for measuring offset of component mounting apparatus (2004-08-31),

12. 6754549 - Parts mounting apparatus and parts checking method by the same (2004-06-22),

13. 6681468 - Device and method for mounting parts (2004-01-27),

14. 6581282 - Apparatus for mounting electronic components (2003-06-24),

15. 6519838 - Component mounting apparatus (2003-02-18),

Title: Hiroshi Uchiyama: Innovator in Component Bonding Technology

Introduction

Hiroshi Uchiyama is a prominent inventor based in Kofu, Japan, known for his significant contributions to the field of component bonding technology. With a total of 17 patents to his name, Uchiyama has developed innovative methods and devices that enhance the precision and efficiency of electronic component assembly.

Latest Patents

Uchiyama's latest patents include a component bonding method and device that improve bonding precision when attaching electrodes of components to flat panels. This method features a control unit with a position displacement amount correction unit that adjusts the position for subsequent components based on feedback from previous bonding processes. Additionally, a bonding recognition device calculates position displacement amounts to ensure accurate alignment during the bonding process. Another notable invention is an electronic parts installation device and cassette control device, which allows for high-speed processing even as the number of cassettes and nozzles increases. This device utilizes a storage unit to manage operation patterns for each nozzle, optimizing the assembly process.

Career Highlights

Throughout his career, Uchiyama has worked with notable companies such as Matsushita Electric Industrial Co., Ltd. and Panasonic Corporation. His experience in these organizations has contributed to his expertise in developing advanced bonding technologies.

Collaborations

Uchiyama has collaborated with esteemed colleagues, including Osamu Okuda and Hirofumi Obara, further enhancing his innovative work in the field.

Conclusion

Hiroshi Uchiyama's contributions to component bonding technology have made a significant impact on the electronics industry. His innovative patents and collaborative efforts continue to drive advancements in precision bonding methods.

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