The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2010
Filed:
Feb. 28, 2007
Toshihiko Tsujikawa, Osaka, JP;
Hiroshi Uchiyama, Osaka, JP;
Akira Yamada, Osaka, JP;
Takashi Iwahashi, Osaka, JP;
Toshihiko Tsujikawa, Osaka, JP;
Hiroshi Uchiyama, Osaka, JP;
Akira Yamada, Osaka, JP;
Takashi Iwahashi, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
Provided is a component bonding method with higher bonding precision in a process of bonding an electrode of a component to an electrode formed on a flat panel. A preliminary press bonding device includes: a control unit which includes a position displacement amount correction unit to which a position displacement amount after the press bonding process is fed back and which corrects the position displacement on the next component to be preliminarily bonded; and a component position determining unit which determines a position of the component using the fed back correction amount. On the other hand, a press bonding device includes a bonding recognition device for use in the recognition of positions of the electrodes on the flat panel and the component. The bonding recognition device includes a position displacement amount calculating unit which calculates the position displacement amount based on the recognized position information.