The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2005

Filed:

Feb. 19, 2002
Applicants:

Osamu Okuda, Hirakata, JP;

Hiroshi Uchiyama, Kofu, JP;

Hiroshi Furuya, Yamanashi-ken, JP;

Yoshihiro Mimura, Izumi, JP;

Inventors:

Osamu Okuda, Hirakata, JP;

Hiroshi Uchiyama, Kofu, JP;

Hiroshi Furuya, Yamanashi-ken, JP;

Yoshihiro Mimura, Izumi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K003/30 ;
U.S. Cl.
CPC ...
Abstract

A component mounting method including carrying in a circuit board to a component mounting position and carrying out the circuit board after component-mounting operation. The component mounting operation includes sucking up the component from the component feed section and moving the component to the mounting position, and mounting the component on a specified site of the circuit board. Also, a remaining-component discarding operation is performed to discard a component which remains at the suction nozzle during a specified time period following the component-mounting operation while the component mounting operation is stopped.


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