Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Hiroshi Uchiyama

Osamu Okuda

Hirofumi Obara

Akira Kabeshita

Naoto Mimura

Noriaki Yoshida

Yoshihiro Mimura

Takeshi Kuribayashi

Takeyuki Kawase

Akihiko Wachi

Takashi Yazawa

Hiroshi Satoh

Nobuyuki Kakita

Kazuo Mori

Hiroshi Furuya

Akira Yamada

Tomoyuki Nakano

Toshihiko Tsujikawa

Shigeki Imafuku

Kimiaki Sano

Atsushi Tanabe

Yoshiyuki Hattori

Junkei Shimizu

Yoichi Tanaka

Youichi Tanaka

Takahiro Kurokawa

Takanori Yoshitake

Toshiyuki Kino

Kazunori Kanai

Takashi Iwahashi

Tetsutarou Hachimura

Izumi Miura

Tamaki Ogura

Tetsuya Mori

Takaaki Yokoi

Kenji Kamakura

Iwao Kanetaka

Provided is a component bonding method with higher bonding precision in a process of bonding an electrode of a component to an electrode formed on a flat panel. A preliminary press bonding device includes: a control unit which includes a position displacement amount correction unit to which a position displacement amount after the press bonding process is fed back and which corrects the position displacement on the next component to be preliminarily bonded; and a component position determining unit which determines a position of the component using the fed back correction amount. On the other hand, a press bonding device includes a bonding recognition device for use in the recognition of positions of the electrodes on the flat panel and the component. The bonding recognition device includes a position displacement amount calculating unit which calculates the position displacement amount based on the recognized position information.

Component bonding method and component bonding device

A cassette control device by which high-speed processing can be expected even by using an arithmetical unit with current processing capability, even when the number of cassettes increases simultaneously with an increase in the number of nozzles which can suck electronic parts. There is provided storage unit () having storage regions in which programs for respective operation patterns of the cassettes (-to-M) are set for each of the nozzles. An arithmetic unit () extracts a specific program required for driving in a specific operation pattern based on a command () inputted according to the content of packaging, from a specific region which is provided in the storage unit () to correspond to a specific nozzle to be used, and the arithmetic unit () operates the specific cassette using the specific program.

Electronic parts installation device and cassette control device

The present invention provides a device and a method for determining whether or not a component holder is good, which enable detecting component holders that are to affect correct component recognition and further enable preventing interferences between constituent devices, a component mounting apparatus with the determining device, and a component mounting method. The determining device has an illuminating device, a CCD camera and a controller to determine whether or not a suction nozzle is good based on luminance at a component hold face of the suction nozzle. The suction nozzle having light reflectance of the component hold face increased to a level whereat a correct recognition of an electronic component held by the suction nozzle is affected, can be detected accordingly. An interference preventing device is also provided, so that interference between the CCD camera and the suction nozzle can be prevented.

Method for determining whether a component holder is defective

An occurrence of component lack at a component arrangement position, designated by a mounting program, of a component feed part, which feeds components to be mounted, is determined. Whether a spare component for the lacking component to be mounted is present in a spare component feed area of the component feed part is determined, and supply of the component to be mounted from a designated component arrangement position of the component feed part is switched to supply of the spare component from the spare component feed area.

Method and apparatus for feeding components, and method and apparatus for mounting components

An apparatus and a method for mounting electronic components are provided which shorten a cycle time required for mounting and enable a component mounting machine to be arranged in a small area. There is provided a controller, so that a retreat control for a second electronic component is performed to a second component feeder so as to avoid an interference if a first electronic component or a component holder interferes with the second electronic component of the second component feeder because of movement of a mounting head. The time conventionally required for moving up and down a component holder can be reduced, and moreover the need of uselessly moving along a detour at a time of moving the mounting head is eliminated. The cycle time can be shortened, and eventually costs can be reduced.

Electronic component mounting apparatus and method

Disclosed are a component recognizing method and apparatus, and a component mounting method and apparatus, by which components with various heights held by a plurality of nozzles can be recognized continuously. The drive of a head is transmitted to nozzles, with surfaces to be recognized of components being controlled so as to be positioned in a recognizable range during respective recognizing operations of the components, and a continuous recognition is thereby made possible. The adjustment of heights of the surfaces to be recognized during the recognizing operations of the components is achieved by one drive unit and a plurality of drive transmitting units.

Component recognizing method and apparatus, and component mounting method and apparatus

An occurrence component lack at a component arrangement position, designated by a mounting program, of a component feed part, which feeds components to be mounted, is determined. Whether a spare component for the lacking component to be mounted is present in a spare component feed area of the component feed part is determined, and supply of the component to be mounted from a designated component arrangement position of the component feed part is switched to supply of the spare component from the spare component feed area.

Method for feeding a component

A component mounting method including carrying in a circuit board to a component mounting position and carrying out the circuit board after component-mounting operation. The component mounting operation includes sucking up the component from the component feed section and moving the component to the mounting position, and mounting the component on a specified site of the circuit board. Also, a remaining-component discarding operation is performed to discard a component which remains at the suction nozzle during a specified time period following the component-mounting operation while the component mounting operation is stopped.

Method of mounting component on circuit board

A parts mounting method employing a suction section having a plurality of suction nozzles is provided. The suction section is moved to a parts supply section in which a plurality of parts are suctioned by the suction nozzles at the same time. The parts are then mounted onto a board. The suction nozzles are divided into groups: a first group having a shift amount within an allowable range in which simultaneous suction is possible; and a second group having a shift amount outside the allowable range in which simultaneous suction is possible. The parts are then sucked at the same time for each of the groups.

Method for mounting electronic component

An offset measuring board is formed of a rectangular metal plate which can be positioned at a component mounting position by a positioning device and which has at least in proximity to one corner portion thereof a recognition through hole, serving as a recognition mark, having a black bottom face within a recessed portion.

Board for measuring offset of component mounting apparatus, and method for measuring offset of component mounting apparatus

The present invention allows a parts remaining number to be efficiently controlled using adaptability check result of an electronic part added during operation, and allows the electronic part to be mounted without mistake. For this object, the present invention includes: parts remaining number controlling means for monitoring a parts remaining number decreasing with mounting and for issuing warning of running out of part when a predetermined remaining number is reached; parts checking means for checking and confirming whether or not an added part for the part to which the warning of running out of part is issued or an added part when a kind is changed is a correct kind of part and for outputting check result and a parts adding number; and check result determining means for monitoring whether or not the check of the part to be taken out is finished when the mounting unit takes out the part from the part feeding means, confirming the check result when it is determined as finished, and renewing the parts remaining number based on the parts adding number when the check result is correct.

Parts mounting apparatus and parts checking method by the same

A component mounting apparatus and method allows for components supplied from component supplying members to be simultaneously or continuously held by component holding members without being affected by positional displacements of the component holding members relative to a head, a positional displacement of the component supplying members or the like. With a positional displacement amount (&Dgr;y) along a Y direction relative to a reference position of a nozzle taken into account, at a component supply cassette, driving a motor for moving components one by one along the Y direction to a component supply position is controlled, thereby positionally adjusting a component at the component supply position and absorbing the positional displacement amount.

Device and method for mounting parts

A slide-type solvent transfer unit is used, and a plurality of nozzles at a head part which suck and hold components are moved down simultaneously to transfer flux to electronic components. In comparison with an electronic component mounting method including a transfer operation whereby nozzles are lowered one by one by a conventional electronic component mounting apparatus equipped with a rotary type solvent transfer unit, the time required for moving the nozzles up and down is shortened and a total cycle time is reduced, so that production efficiency is improved.

Apparatus for mounting electronic components

A component mounting apparatus includes a board transfer section for carrying in circuit boards to a component mounting position and carrying out the circuit board after component-mounting operation. A component feed section is provided for feeding, to a specified position, a component to be mounted onto the circuit board, and a component mounting section is provided for loading a suction nozzle matching the component to be mounted, sucking up the component from the component feed section and moving the component to the mounting position, and mounting the component on a specified site of the circuit board. A controller is provided for controlling operations of the individual sections is order to execute a productional operation of component-mounting onto the circuit boards. Also, a remaining-component discarding device performs an operation of discarding a component which remains at the suction nozzle during a time period following the component-mounting operation while the component mounting section is kept halted.

Growing community of inventors

Kofu, Japan

Hiroshi Uchiyama