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Hiroshi Suzuki

USPTO Granted Patents = 17

EPO Patents = 1

Average Co-Inventor Count = 2.6

ph-index = 5

Forward Citations = 89(Granted Patents)

Location History:

Ichikawa, JP (1994)
Ichihara, JP (1994 - 2012)
Chiba, JP (1997 - 2012)

Company Filing History:

Nippon Soda Co., Ltd.

Kawasaki Steel Corporation

Denki Kagaku Kogyo Kabushiki Kaisha

Universal Bio Research Co., Ltd.

5. 1 out of 4,979

Oki Electric Industry Co., Ltd.

6. 1 out of 1,109

Chisso Corporation

Years Active: 1994-2012

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17 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8307722 - Method of detecting dispensed quantity, and liquid suction monitoring dispensing apparatus (2012-11-13),

2. 8304501 - Composition containing silsesquioxane and silsesquioxane-containing hydroxyalkyl cellulose resin composition (2012-11-06),

3. 7943803 - Clathrate compound, method for controlling concentration of aqueous agricultural chemical active ingredient solution, and agricultural chemical formulation (2011-05-17),

4. 7737309 - Clathrate compound, method for controlling concentration of aqueous agricultural chemical active ingredient solution, and agricultural chemical formulation (2010-06-15),

5. 7601784 - Molecular compounds containing polymers having hydrogen bond sites as the constituent compounds (2009-10-13),

6. 7495060 - Tetrakisphenol and non-clathrated curing agent for epoxy resin (2009-02-24),

7. 7309531 - El device (2007-12-18),

8. 6927309 - Sulfur compounds and intermolecular compounds containing the same as the component compounds (2005-08-09),

9. 6740782 - Sulfur compounds and intermolecular compounds containing the same as the component compounds (2004-05-25),

10. 6727325 - Composition of epoxy resin and clathrate of tetrakisphenol and epoxy-reactive curing compound (2004-04-27),

11. 6577507 - Automatic circuit board plug-in system (2003-06-10),

12. 6566548 - Molecular compounds containing novel carboxylic acid derivatives as the constituent compound (2003-05-20),

13. 6107411 - Block copolymer, block copolymer composition and heat shrinkable films (2000-08-22),

14. 6107388 - Polyolefin resin compositions (2000-08-22),

15. 5649207 - Microprocessor unit having interrupt mechanism (1997-07-15),

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