The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2009

Filed:

Aug. 25, 2006
Applicants:

Hiroshi Suzuki, Chiba, JP;

Satoru Abe, Chiba, JP;

Midori Aoki, Legal Representative, Ichihara, JP;

Inventors:

Hiroshi Suzuki, Chiba, JP;

Satoru Abe, Chiba, JP;

Midori Aoki, legal representative, Ichihara, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/62 (2006.01); C08L 63/00 (2006.01); C08L 63/02 (2006.01); C08L 63/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in thermal stability that is extremely important for the control of a curing reaction and to have a prolonged pot life (stability as a one-pack mixture comprising the epoxy resin, curative, etc.) and improved curability at low temperatures. The curative is characterized by being a clathrate comprising a tetrakisphenol compound represented by a general formula (I), wherein X represents (CH)n, wherein n is 0, 1, 2 or 3, and Rto Reach represents hydrogen, a lower alkyl, optionally-substituted phenyl, halogeno or a lower alkoxy, and the curing accelerator is characterized by being a clathrate comprising a tetrakisphenol compound represented by the general formula (I) shown above and a compound accelerating the curing of a compound which reacts with the epoxy group of an epoxy resin to cure the resin.


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