Company Filing History:
1 out of 3,781 
1 out of 336 
1 out of 30 
Years Active: 2006
Title: Hiroshi Shimoji: Innovator in Semiconductor Technology
Introduction
Hiroshi Shimoji is a notable inventor based in Hamura, Japan. He has made significant contributions to the field of semiconductor technology, particularly in improving production yields for advanced packaging solutions.
Latest Patents
Hiroshi Shimoji holds 1 patent for a semiconductor device. This invention aims to enhance the production yield of Quad Flat Non-leaded packages (QFN) and achieve a multi-pin structure. The patent describes a method where a resin sealing member, used to seal a semiconductor chip, is formed by molding. After this process, both the peripheral portion of the resin sealing member and a lead frame are cut along a specific cutting line. This line is strategically positioned inside the molding line, which runs along the outer edge of the resin sealing member. As a result, the entire surface of each lead, exposed to the cut faces of the resin sealing member, is covered with resin. This innovative approach effectively prevents the occurrence of metallic burrs on the cut faces of the leads.
Career Highlights
Throughout his career, Hiroshi Shimoji has worked with prominent companies in the semiconductor industry. He has been associated with Renesas Technology Corporation and Hitachi ULSI Systems Co., Ltd. His experience in these organizations has contributed to his expertise in semiconductor device development.
Collaborations
Hiroshi has collaborated with notable colleagues, including Fujio Ito and Hiromichi Suzuki. Their combined efforts have further advanced the field of semiconductor technology.
Conclusion
Hiroshi Shimoji's contributions to semiconductor technology, particularly through his innovative patent, highlight his role as a key inventor in this field. His work continues to influence advancements in semiconductor packaging solutions.