Hiroshi Sawada

Title: Hiroshi Sawada: Innovator in Thin Film Technology

Introduction

Hiroshi Sawada is a prominent inventor based in Kusatsu, Japan. He has made significant contributions to the field of thin film technology, holding a total of 4 patents. His innovative approaches have led to advancements in adhesion methods and mechanical seal designs.

Latest Patents

One of Sawada's latest patents is a method for enhancing adhesion of thin films. This method involves irradiating the surface of a parent material with a laser beam at a fluence near the machining threshold. By scanning the irradiated part while overlapping to form a grating structure, a solid thin film can be created that exhibits enhanced adhesion and surface functions. These functions include reduced friction and wear, suppression of fine particle adhesion, and improved cell sensitivity.

Another notable patent is for a mechanical seal sliding member. This invention features high lubricating characteristics, lowering and stabilizing the coefficient of friction and temperature of sliding surfaces without excessive leakage. The sliding surface is designed with multiple grating sections, each containing linear ridge portions formed at a predetermined angle to the sliding direction. This periodic structure significantly improves lubricating characteristics.

Career Highlights

Hiroshi Sawada has worked with notable companies such as Canon Machinery Inc. and NEC Machinery Corporation. His experience in these organizations has contributed to his expertise in mechanical engineering and thin film technology.

Collaborations

Sawada has collaborated with several professionals in his field, including Yoshihiro Teshima and Kou Kurosawa. These collaborations have fostered innovation and development in his projects.

Conclusion

Hiroshi Sawada's contributions to thin film technology and mechanical seals demonstrate his innovative spirit and technical expertise. His patents reflect a commitment to enhancing product performance and functionality.