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Hiroomi Torii

USPTO Granted Patents = 11 (Patent Applications = 1)

EPO Patents = 2

Average Co-Inventor Count = 4.0

ph-index = 4

Forward Citations = 50(Granted Patents)

Location History:

Kanagawa, JP (2006 - 2010)
Tokyo, JP (2004 - 2013)

Company Filing History:

11 out of 2,508

Ebara Corporation

Years Active: 2004-2013

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11 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8550875 - Method of operating substrate processing apparatus and substrate processing apparatus (2013-10-08),

2. 8202139 - Method of operating substrate processing apparatus and substrate processing apparatus (2012-06-19),

3. 8118640 - Wafer transferring apparatus, polishing apparatus, and wafer receiving method (2012-02-21),

4. 7942725 - Polishing apparatus (2011-05-17),

5. 7645185 - Substrate delivery mechanism (2010-01-12),

6. 7445543 - Polishing apparatus (2008-11-04),

7. 7160180 - Substrate delivery mechanism (2007-01-09),

8. 7083506 - Polishing apparatus (2006-08-01),

9. 7063598 - Substrate delivery mechanism (2006-06-20),

10. 6783445 - Polishing apparatus (2004-08-31),

11. 6746312 - Polishing method and polishing apparatus (2004-06-08),

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