Mie, Japan

Hironobu Yamamoto

This inventor holds 31 USPTO granted patents and 1 published patent application and 1 EPO patent, primarily in Wiring Components. Top assignee: Sumitomo Wiring Systems, Limited. Active years: 2016-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hironobu Yamamoto. Retrieved from https://idiyas.com/inventor/hironobu-yamamoto

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 31 

% Patents Active = 100.0


Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 19(Granted Patents)


Location History:

  • Mie, JP (2017 - 2022)
  • Yokkaichi, JP (2016 - 2024)

Company Filing History:


Years Active: 2016-2026

Loading Chart...
Loading Chart...
Areas of Expertise:
Composite Molding
Wiring Member
Sensor Device
Waterproof Structure
Wheel Speed Sensor
Electrical Conduction
Molded Connector
Magnetic Sensor
Bracket
Terminal Manufacturing
Resin Molded Article
31 patents (USPTO):Explore Patents

Title: Hironobu Yamamoto: Innovator in Wiring Solutions from Mie, Japan

Introduction

Hironobu Yamamoto, a prolific inventor based in Mie, Japan, has made significant contributions in the field of electrical wiring and sensor technology. With 26 patents to his name, he showcases a remarkable ability to innovate and enhance existing technologies.

Latest Patents

Among his recent patents, the "Wiring Member" stands out for its novel design, which includes a linear transmission member coupled with an electric wire, a connector housing, and an outer armor member. Notably, it features a cover member that allows relative movement in the lengthwise direction of the electric wire while being securely positioned by the connector housing and outer armor member. This innovative cover member is an elastic component designed to provide flexibility and compression-deformability, improving the overall efficiency of wiring systems.

Another significant patent is for a "Sensor Device," which aims to enhance the resilience of sensor devices against external damage. This invention involves a sensor element encased in a specially designed resin cover part, with cross-linked portions on its surface, contributing to its durability and protective capabilities.

Career Highlights

Hironobu Yamamoto is currently associated with Sumitomo Wiring Systems, Limited, where he continues to contribute to advancements in wiring technologies. His dedication to research and development has played a crucial role in establishing the company as a leader in the industry.

Collaborations

Throughout his career, Yamamoto has collaborated with talented professionals, including Toshinari Kobayashi and Kyungwoo Kim. These partnerships have been instrumental in fostering creativity and innovation within their projects, resulting in groundbreaking inventions that benefit both their company and the engineering community.

Conclusion

Hironobu Yamamoto’s innovative work in wiring members and sensor devices exemplifies the spirit of creativity and technical expertise. As he continues to develop new technologies, his contributions will undoubtedly leave a lasting impact on the field and inspire future generations of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…