The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2025

Filed:

Jul. 30, 2021
Applicant:

Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;

Inventors:

Hironobu Yamamoto, Yokkaichi, JP;

Kyungwoo Kim, Yokkaichi, JP;

Toshinari Kobayashi, Yokkaichi, JP;

Yukitoshi Terasaka, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01D 11/24 (2006.01); G01D 11/16 (2006.01);
U.S. Cl.
CPC ...
G01D 11/245 (2013.01); G01D 11/16 (2013.01);
Abstract

The object of the present disclosure is to minimize a number of positioning pins used to position an inner molded portion when an outer molded portion is molded around the inner molded portion. The present disclosure provides a composite molded component including an inner molded portion and an outer molded portion that covers the inner molded portion. An anti-rotation detent hole, which is open at a surface of the inner molded portion, is formed in the inner molded portion, a through hole that extends from a surface of the outer molded portion to the anti-rotation detent hole is formed in the outer molded portion, the anti-rotation detent hole is a hole that is delimited by an inner peripheral surface and a bottom surface, and at least part of the inner peripheral surface is formed in a non-circular shape.


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