The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2026
Filed:
May. 19, 2021
Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;
Hironobu Yamamoto, Yokkaichi, JP;
Yukitoshi Terasaka, Yokkaichi, JP;
Kyungwoo Kim, Yokkaichi, JP;
Toshinari Kobayashi, Yokkaichi, JP;
Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;
Abstract
The object of the present invention is to further improve the performance of a seal between an inner molded portion and an outer molded portion. A composite molded component includes: an internal component; an inner molded portion that covers the internal component; and an outer molded portion that covers the inner molded portion. A hole that reaches the inner molded portion is formed in the outer molded portion. A ring-shaped seal portion that surrounds the hole is provided between the inner molded portion and the outer molded portion. The ring-shaped seal portion is formed of a softer material than the inner molded portion.