Tokyo, Japan

Hironobu Ozawa

This inventor holds 1 USPTO granted patent and 6 published patent applications. Top assignee: Disco Corporation. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hironobu Ozawa. Retrieved from https://idiyas.com/inventor/hironobu-ozawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Hironobu Ozawa: Innovator in Wafer Processing Technology

Introduction

Hironobu Ozawa is a prominent inventor based in Tokyo, Japan. He is known for his contributions to the field of wafer processing technology. With a focus on enhancing the efficiency and effectiveness of wafer processing, Ozawa has made significant strides in this specialized area.

Latest Patents

Ozawa holds a patent for a wafer processing apparatus. This innovative apparatus includes a chuck table for holding a bonded wafer, a grinding unit for grinding the bonded wafer, a cleaning unit for cleaning the bonded wafer, and a processing unit for removing a beveled portion of the outer circumferential end of the bonded wafer. The processing unit features a support that holds the bonded wafer with an exposed surface and a laser beam applying unit that emits a laser beam transmittable through the wafer. This technology allows for the formation of a modified layer in the wafer, facilitating the removal of the beveled portion effectively.

Career Highlights

Hironobu Ozawa is associated with Disco Corporation, a company renowned for its advanced semiconductor manufacturing equipment. His work at Disco Corporation has positioned him as a key player in the development of innovative wafer processing solutions. His expertise and dedication to improving wafer processing techniques have garnered recognition within the industry.

Collaborations

Ozawa has collaborated with notable colleagues, including Kentaro Iizuka and Kazuya Hirata. These collaborations have contributed to the advancement of wafer processing technologies and have fostered a culture of innovation within their team.

Conclusion

Hironobu Ozawa's contributions to wafer processing technology exemplify his commitment to innovation and excellence. His patent for a wafer processing apparatus showcases his ability to address complex challenges in the semiconductor industry. Through his work at Disco Corporation and collaborations with esteemed colleagues, Ozawa continues to make a significant impact in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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