The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2025
Filed:
Dec. 05, 2023
Disco Corporation, Tokyo, JP;
Kentaro Iizuka, Tokyo, JP;
Kazuya Hirata, Tokyo, JP;
Hayato Iga, Tokyo, JP;
Hironobu Ozawa, Tokyo, JP;
Mato Hattori, Tokyo, JP;
Hideo Iwata, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A processing apparatus includes a chuck table for holding a bonded wafer thereon, a grinding unit for grinding the bonded wafer, a cleaning unit for cleaning the bonded wafer, and a processing unit for removing a beveled portion of an outer circumferential end portion of the bonded wafer before the grinding unit grinds the bonded wafer. The processing unit includes a support for supporting the bonded wafer with a surface thereof being exposed and a laser beam applying unit for emitting a laser beam having a wavelength transmittable through the wafer. The laser beam applying unit applies the laser beam to the wafer supported on the support, from the exposed surface, while positioning a focused spot thereof within the outer circumferential excessive region of the wafer, to form a modified layer in the wafer along which to remove the beveled portion from the wafer.