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For the Inventor, By the Inventor

Matsumoto, Japan

Hiromichi Gohara

This inventor holds 47 USPTO granted patents and 7 published patent applications and 6 EPO patents, primarily in Semiconductor Technology. Top assignees: Fuji Electric Co., Ltd., Honda Motor Co., Ltd., Waseda University. Active years: 2014-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiromichi Gohara. Retrieved from https://idiyas.com/inventor/hiromichi-gohara

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 47 

% Patents Active = 97.9

 

Average Co-Inventor Count = 3.0

ph-index = 6

Forward Citations = 122(Granted Patents)


Location History:

  • Matsumo, JP (2017)
  • Kanagawa, JP (2019 - 2021)
  • Nagano, JP (2019 - 2023)
  • Matsumoto, JP (2014 - 2024)
  • Kawasaki, JP (2016 - 2024)

Company Filing History:

goldMedal47 out of 4,826 
 
Fuji Electric Co., Ltd.
 patents
silverMedal2 out of 22,006 
 
Honda Motor Co., Ltd.
 patents
bronzeMedal2 out of 164 
 
Waseda University
 patents
4. 1 out of 4 
 
Kojin Co., Ltd.
 patents
5. 1 out of 318 
 
Nippon Light Metal Company, Ltd.
 patents
6. 1 out of 2,643 
 
The Furukawa Electric Co., Ltd.
 patents
where one patent can have more than one assignee

Years Active: 2014-2025

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Areas of Expertise:
Semiconductor Module
Cooling System
Heat Exchanger
Power Semiconductor
Manufacturing Method
Heat Sink
Cooling Apparatus
Wire Bonding
Electric Vehicle
Reinforcing Board
Heat Dissipating Substrate
Cooling Fins
47 patents (USPTO):Explore Patents
1. 12249556 - Cooler and semiconductor apparatus (2025-03-11),
2. 12148631 - Semiconductor module, method for manufacturing semiconductor module, and level different jig (2024-11-19),
3. 12127382 - Semiconductor module with cooling fins in a matrix form (2024-10-22),
4. 12087655 - Semiconductor apparatus and vehicle (2024-09-10),
5. 12074091 - Semiconductor device with cooler including heat dissipating substrate having a plurality of fins bonded to reinforcing plate (2024-08-27),
6. 12072155 - Heat exchanger having cured edge (2024-08-27),
7. 11996350 - Cooler and semiconductor apparatus (2024-05-28),
8. 11908772 - Semiconductor module and vehicle (2024-02-20),
9. 11664296 - Semiconductor module and vehicle (2023-05-30),
10. D983759 - Semiconductor module (2023-04-18),
11. 11624562 - Heat sink (2023-04-11),
12. 11582889 - Semiconductor module and vehicle (2023-02-14),
13. 11581252 - Semiconductor module and wire bonding method (2023-02-14),
14. 11501980 - Semiconductor module, method for manufacturing semiconductor module, and level different jig (2022-11-15),
15. 11444004 - Cooler (2022-09-13),

Title: The Innovative Mind of Hiromichi Gohara

Introduction: Hiromichi Gohara is a pioneering inventor hailing from Matsumoto, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Hiromichi Gohara holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Gohara has worked tirelessly to push the boundaries of what is possible in the realm of technology. His inventions have not only revolutionized industries but have also improved the quality of life for many around the world.

Collaborations: Throughout his career, Hiromichi Gohara has collaborated with leading research institutions, universities, and tech companies to bring his ideas to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion: In conclusion, Hiromichi Gohara stands as a testament to the power of innovation and the impact that one individual can have on the world. His relentless pursuit of excellence and his passion for pushing the limits of technology make him a true visionary in the field of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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