The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2024
Filed:
Sep. 10, 2021
Nippon Light Metal Company, Ltd., Tokyo, JP;
Fuji Electric Co., Ltd., Kanagawa, JP;
Kojin Co., Ltd., Toyama, JP;
Akihito Aoki, Shizuoka, JP;
Eiji Anzai, Shizuoka, JP;
Yoshinari Ikeda, Matsumoto, JP;
Hiromichi Gohara, Matsumoto, JP;
Ryoichi Kato, Matsumoto, JP;
Michihiro Inaba, Toyama, JP;
Tetsuya Sunago, Toyama, JP;
NIPPON LIGHT METAL COMPANY, LTD., Tokyo, JP;
FUJI ELECTRIC CO., LTD., Kanagawa, JP;
KOJIN CO., LTD., Toyama, JP;
Abstract
A cooling device includes a body having a flow passage for a heating medium that passes through the body, a first header made of a resin that has an inlet and covers a first end, and a second header made of a resin that has an outlet and covers a second end. The body has a front face, a back face, a first side face, and a second side face. The body and the first header are bonded to a first bonding face, a second bonding face, a third bonding face, and a fourth bonding face. The third bonding face is a curved surface that protrudes toward a +Y side. The fourth bonding face is a curved surface that protrudes toward a −Y side.