Hiroki Chisaka

This inventor holds 31 USPTO granted patents and 9 published patent applications and 16 EPO patents. Top assignees: Tokyo Ohka Kogyo Co., Ltd., Daicel Corporation, Eneos Corporation. Active years: 2016-2025.

USPTO Granted Patents = 31 (Patent Applications = 9)

% Patents Active = 100.0

EPO Patents = 16 (Patent Applications = 19)

Average Co-Inventor Count = 3.8

ph-index = 3

Forward Citations = 20(Granted Patents)

Location History:

Kanagawa, JP (2018 - 2022)
Kawasaki, JP (2016 - 2024)

Company Filing History:

31 out of 1,236

Tokyo Ohka Kogyo Co., Ltd.

where one patent can have more than one assignee

Years Active: 2016-2025

Loading Chart...

Areas of Expertise:

Photosensitive Ink Composition

Curable Composition

Polyimide Film

Energy-Sensitive Resin

Silicon-Containing Resin

Optical Film

Vinyl Ether Compound

Metal Surface Treatment

Microparticles

Polybenzoxazole Resin

Fiber-Reinforced Composite Material

Photoacid Generator

31 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12422749 - Photosensitive ink composition, cured product, display panel, and method for producing cured product (2025-09-23),

2. 12379664 - Photosensitive ink composition, cured product, display panel, and method for producing cured product (2025-08-05),

3. 11926681 - Curable composition, cured product, and method for producing cured product (2024-03-12),

4. 11905433 - Energy-sensitive composition, cured product, and forming method of cured product (2024-02-20),

5. 11718717 - Resin composition, method for producing resin composition, film formation method, and cured product (2023-08-08),

6. 11718587 - Compound, epoxy curing catalyst and method for producing compound (2023-08-08),

7. 11274245 - Curable composition, film, optical film, light-emitting display element panel, and light-emitting display (2022-03-15),

8. 11136435 - Method for producing polyimide film, polyimide film, polyamic acid solution, and photosensitive composition (2021-10-05),

9. 10954340 - Polyimide precursor composition (2021-03-23),

10. 10829662 - Curable composition, cured product, cured film, display panel, and method for producing cured product (2020-11-10),

11. 10767017 - Resin composition, method for producing resin composition, film formation method, and cured product (2020-09-08),

12. 10747113 - Method of pattern formation and method of producing polysilane resin precursor (2020-08-18),

13. 10696845 - Energy-sensitive resin composition (2020-06-30),

14. 10689514 - Silicon-containing resin composition (2020-06-23),

15. 10640607 - Curable composition, cured film, display panel, and method for producing cured product (2020-05-05),

Title: The Innovative Journey of Hiroki Chisaka

Introduction: Hiroki Chisaka, a visionary inventor hailing from Kawasaki, Japan, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Hiroki Chisaka's latest patents include a cutting-edge AI-powered robotics system for industrial automation, a revolutionary sustainable energy storage solution, and a pioneering medical device for remote patient monitoring.

Career Highlights: With a career spanning over two decades, Hiroki Chisaka has established himself as a leading figure in the field of technology innovation. He has held key positions in renowned tech companies, where he spearheaded research and development projects that have pushed the boundaries of what is possible.

Collaborations: Throughout his career, Hiroki Chisaka has collaborated with top research institutions, universities, and industry experts to bring his ideas to life. His ability to work seamlessly in multidisciplinary teams has led to the successful implementation of cutting-edge technologies in various sectors.

Conclusion: Hiroki Chisaka's relentless pursuit of innovation and his passion for creating solutions to complex challenges have cemented his reputation as a trailblazer in the world of technology. His work continues to inspire the next generation of inventors and shape the future of technological advancements.