Tokyo Ohka Kogyo Co., Ltd.

Daicel Corporation

Eneos Corporation

Hiroki Chisaka

Dai Shiota

Kunihiro Noda

Kazuya Someya

Koichi Misumi

Naozumi Matsumoto

Shinichi Komatsu

Yasuyuki Akai

Wataru Suzuki

Mayumi Kuroko

Yoshinori Tadokoro

Tsutomu Watanabe

Yasushi Fujii

Kazuhiro Uehara

Issei Suzuki

Masaru Shida

Kyohei Ishida

Ichiro Takase

Kyuhei Kitao

Jiro Hikida

Tatsuro Ishikawa

Yasuhide Ohuchi

Yukitsugu Maeda

Takafumi Imoto

Kouhei Fujita

Yoshiya Narasaki

Daisuke Tanida

Kieko Hanano

Shinsuke Kawatsu

A liquid photosensitive ink composition capable of forming a cured product with a high refractive index and applicable to an inkjet method even though the photosensitive ink composition does not include the solvent, or include small amount of the solvent, a cured product of the photosensitive ink composition, a display panel having a film consisting of the cured product, and a method for producing the cured product using the above photosensitive ink composition. In a photosensitive ink composition including a photopolymerizable compound, metal compound particles, and a photopolymerization initiator, a sulfide compound having specific structure and a (meth)acrylate compound having specific structure as the photopolymerizable compound, and at least one selected from the group consisting of titanium oxide particles, barium titanate particles, cerium oxide particles, and zinc sulfide particles, as the metal compound particles are used.

Photosensitive ink composition, cured product, display panel, and method for producing cured product

A liquid photosensitive ink composition capable of forming a cured product with a high refractive index and a high transparency, a cured product of the photosensitive ink composition, a display panel having a film consisting of the cured product, and a method for producing the cured product using the photosensitive ink composition. In a photosensitive ink composition including a photopolymerizable compound, and a photopolymerization initiator, a sulfide compound having specific structure and a (meth)acrylate compound having specific structure are used as the photopolymerizable compound, and a phosphine oxide compound and an oxime ester compound are used as the photopolymerization initiator.

A curable composition capable of forming a cured product having a high refractive index and suppressed increase in reflectance, a cured product of the curable composition, and a method for producing the cured product using the curable composition. The curable composition includes a photopolymerizable monomer, metal oxide nanoparticles, and a photopolymerization initiating agent. The photopolymerizable monomer includes a compound represented by the following formula (a1). In the formula, Rand Reach independently represents a single bond or an alkylene group, Rrepresents an alkyl group, an alkenyl group, an alkoxy group, or a hydroxy group, and n represents 0 or 1

Curable composition, cured product, and method for producing cured product

An energy-sensitive composition that yields a cured product with excellent thermal resistance and crack resistance, a cured product of the composition, and a method of forming a cured product. The energy-sensitive composition includes a polysilane and a thermal base generator, in which the thermal base generator includes an ionic compound and a nonionic compound. An anion moiety in the ionic compound preferably includes at least one of an anion having an oxaxanthone skeleton, an anion having a ketoprofen skeleton, and an anion having a fluorenone skeleton.

Energy-sensitive composition, cured product, and forming method of cured product

A novel compound suitable as an epoxy curing catalyst; an epoxy curing catalyst using the compound; and a method for producing the compound. A compound represented by formula (1) in which Xrepresents an m valent counter cation, Rrepresents an aromatic group which may have a substituent; Rrepresents an alkylene group which may have a substituent; Rrepresents a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfonic acid ester group, a phosphino group, a phosphinyl group, a phosphonic acid ester group or an organic group; m represents an integer of 1 or more; n represents an integer of 0-3; and Rmay bond with Rto form a cyclic structure.

Compound, epoxy curing catalyst and method for producing compound

A resin composition including a silicon-containing resin component and a solvent, the silicon-containing resin component includes (I) mentioned below, the solvent including at least one of a terpene compound having at least one of a hydroxy group and an acetoxy group, and a cyclic skeleton-containing acetate compound (excluding the terpene compound):

Resin composition, method for producing resin composition, film formation method, and cured product

To provide a curable composition which can easily form an optical film with good fluorescence efficiency and includes quantum dots (B), a film made of a cured product of the curable composition, an optical film for a light-emitting display element made of the film, a light-emitting display element panel including the optical film, and a light-emitting display equipped with the light-emitting display element panel. A film is formed by curing a curable composition which includes an epoxy compound (A) having two or more epoxy groups and including a cyclic structure other than an oxirane ring, quantum dots (B), and an acid generator (C).

Curable composition, film, optical film, light-emitting display element panel, and light-emitting display

A method for producing a polyimide film includes: obtaining a polyamic acid solution having a viscosity of 5 to 150 cps by preparing a raw material mixture liquid containing a solvent, a tetracarboxylic dianhydride represented by a specific general formula, and an aromatic diamine represented by a specific general formula, and has a total content of the tetracarboxylic dianhydride and aromatic diamine of 15% by mass or less, and reacting the tetracarboxylic dianhydride and aromatic diamine with each other in the raw material mixture liquid forming a polyamic acid having a repeating unit represented by a specific general formula; obtaining a polyimide-forming mixture liquid by adding a compound represented by a specific general formula to the polyamic acid solution; and obtaining a polyimide film represented by a specific general formula by forming a film made of the polyimide-forming mixture liquid, followed by imidization of the polyamic acid in the film.

Method for producing polyimide film, polyimide film, polyamic acid solution, and photosensitive composition

A polyimide precursor composition that exhibits excellent tensile strength and breaking elongation, and that provides a film containing an alicyclic polyimide resin; a method for producing a polyimide film using the polyimide precursor composition; and a permanent film that contains an alicyclic polyimide resin and that exhibits excellent tensile strength and breaking elongation. The polyimide precursor composition is a mixture of a resin precursor component which is a polyamic acid including an alicyclic backbone having a predetermined structure, a monomer component that includes an aromatic diamine compound having a predetermined structure or an alicyclic tetracarboxylic acid di-anhydride having a predetermined structure; an imidazole compound having a predetermined structure; and a solvent.

Polyimide precursor composition

A curable composition capable of forming a cured product having high refractive index and excellent bending resistance, a cured product of the curable composition, a cured film made of the cured product, a display panel provided with the cured film, and a method for producing a cured product using the above-mentioned curable composition. The curable composition includes a curable compound and a curing agent. The curable compound contains a curable compound including, as a main skeleton, a fused ring in which three or more rings including an aromatic ring are fused, followed by mixing a metal oxide in which a capping agent is covalently bonded to a surface thereof.

Curable composition, cured product, cured film, display panel, and method for producing cured product

A resin composition including a silicon-containing resin component and a solvent, the silicon-containing resin component including at least one of (I) and (II) mentioned below, the solvent including at least one of a terpene compound having at least one of a hydroxy group and an acetoxy group, and a cyclic skeleton-containing acetate compound (excluding the terpene compound):

A method of pattern formation. The method is capable of inhibiting a post-development residue from remaining on a support equipped with an electrode, and a method of producing a polysilane-polysiloxane resin precursor that is suitable for use in the method of pattern formation. The method of pattern formation includes forming a film of a silicon-containing composition on the support equipped with an electrode forming a film of a resin composition on the film of a silicon-containing composition, and forming the film of a resin composition into a pattern.

Method of pattern formation and method of producing polysilane resin precursor

An energy-sensitive resin composition with which it is possible, even if the precursor polymer is heat-treated at low temperatures, to produce a film or molded article comprising an imide ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance with a low dielectric constant, or a film or molded article comprising an oxazole ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance. A method of manufacturing the film or molded article; a method of forming a pattern using the energy-sensitive resin composition; and a permanent film having excellent heat resistance, tensile elongation and chemical resistance. The energy-sensitive resin composition includes an imidazole compound, a resin precursor component, and a solvent, the resin precursor component being at least one of a monomer component including a diamine compound, a dicarbonyl compound and/or a tetracarboxylic acid dianhydride; and a precursor polymer having a repeating unit.

Energy-sensitive resin composition

A silicon-containing resin composition with which it is possible to form a silica-based coating film in which generation of cracks is minimized, a method for forming a silica-based coating film using the silicon-containing resin composition, and a crack-free silica-based coating film formed using the silicon-containing resin composition. The silicon-containing resin composition includes a silicon-containing resin and a solvent, in which one or more of siloxane resins and polysilanes is used as the silicon-containing resin, and the solvent contains a cycloalkyl acetate having a specific structure.

Silicon-containing resin composition

A curable composition having satisfactory curability, capable of forming a cured product having satisfactory heat resistance and adhesion to a base material, a cured film made of a cured product of the curable composition, a display panel provided with the cured film, and a method for producing a cured product using the above-mentioned curable composition. The curable composition includes a curable compound and a thermal cationic polymerization initiator, the curable compound contains a cationic polymerizable compound containing, as a main skeleton, a fused ring in which three or more rings including an aromatic ring are fused, and the thermal cationic polymerization initiator contains a quaternary ammonium salt-type compound having a specific structure.

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Kawasaki, Japan

Hiroki Chisaka