Company Filing History:

13 out of 25,550

Sharp Kabushiki Kaisha Corporation

patents

6 out of 6

Teiryo Sangyo Co., Ltd.

patents

6 out of 27,375

Matsushita Electric Industrial Co., Ltd.

patents

4. 1 out of 1

Japan I.d. Tech. Inc.

patent

Years Active: 1979-2008

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26 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7348492 - Flexible wiring board and electrical device using the same (2008-03-25),

2. 7005741 - Liquid crystal display device and/or circuit substrate including bump electrodes and electrode pads (2006-02-28),

3. 6933607 - Semiconductor device with bumps on electrode pads oriented in given direction (2005-08-23),

4. 6525422 - Semiconductor device including bump electrodes (2003-02-25),

5. 6111628 - Liquid crystal display device including plural bump electrodes (2000-08-29),

6. 5609479 - Forced compression type pump (1997-03-11),

7. 5608559 - Display board having wiring with three-layered structure and a display (1997-03-04),

8. 5576869 - Liquid crystal display apparatus including an electrode wiring having (1996-11-19),

9. 5500787 - Electrodes on a mounting substrate and a liquid crystal display (1996-03-19),

10. 5481101 - Two dimensional code data reading apparatus and method (1996-01-02),

11. 5410620 - Digital data reader of digital data recording sheet (1995-04-25),

12. 5408543 - Digital data reader of digital data recording sheet (1995-04-18),

13. 5343031 - Method of decoding a two-dimensional code symbol mark (1994-08-30),

14. 5204515 - Method of reading identification code sheets using borders to determine (1993-04-20),

15. 5128526 - Identification code (1992-07-07),

Title: Innovator Hirokazu Yoshida: A Pioneer in Flexible Wiring Technologies

Introduction: Hirokazu Yoshida, an accomplished inventor based in Osaka, Japan, has made remarkable contributions to the field of electronics through his innovative designs and technologies. With a total of 26 patents to his name, Yoshida has demonstrated a deep commitment to enhancing electrical systems and devices.

Latest Patents: Among his latest patents, one highlights a flexible wiring board and an electrical device that utilizes this advanced technology. This invention involves a copper foil pattern formed on both surfaces of a base polymer film made from polyimide. The innovative aspect lies in the application of an insulative protecting film fully covering the copper foil pattern, except for an end portion that connects to an electrical component via a plated layer. This design prevents insulation failure and wire breakage, ensuring durability even when bent. Another significant patent involves a liquid crystal display device and a circuit substrate that includes bump electrodes and electrode pads, featuring a unique arrangement of bump electrodes that enhances the device's performance.

Career Highlights: Hirokazu Yoshida has held pivotal positions in notable companies, including Sharp Corporation and Teiryo Sangyo Co., Ltd. His expertise in flexible wiring technology has positioned him as a valuable inventor, driving forward the development of cutting-edge electronic components.

Collaborations: Throughout his career, Yoshida has collaborated with esteemed coworkers such as Motoji Shiota and Takumi Mizukawa. These partnerships have fostered an environment of innovation, leading to the creation of advanced technologies that benefit the electronics industry.

Conclusion: Hirokazu Yoshida's innovative spirit and dedication to his craft have solidified his status as a leading inventor in the realm of electronics. His patents reflect a commitment to enhancing technology's reliability and functionality, thereby paving the way for future advancements in the field. As his work continues to influence the industry, Hirokazu Yoshida remains a key figure in driving innovation.

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