Sharp Kabushiki Kaisha Corporation

Matsushita Electric Industrial Co., Ltd.

Teiryo Sangyo Co., Ltd.

Japan I.d. Tech. Inc.

Hirokazu Yoshida

Motoji Shiota

Takumi Mizukawa

Mitsuyuki Kiuchi

Yasunori Chikawa

Keizo Amagami

Atsushi Ono

Akio Inohara

Keiji Yamamura

Kiyoshi Inada

Satoru Tone

Makoto Kanda

Norimitsu Nie

Yasunobu Tagusa

Hiroshi Nakatani

Yoshio Ogino

Tatsuo Saka

Katunobu Awane

Yoshihisa Dotta

Takashi Nukii

Shigeo Nakabu

Masaru Iwasaki

Takashi Nakashima

Shigeo Hamaoka

Hideshi Makita

Hideki Ohmori

Noriko Kawai

Akihiro Kawashima

Hitoshi Wakita

Yuji Matsuda

A flexible wiring board is obtained as follows. A copper foil pattern is formed on the both surfaces of a base polymer film made of polyimide, etc. The copper foil pattern of the both sides, except for an end portion of the copper foil pattern of one surface, is covered entirely with an insulative protecting film made of polyimide, etc., for protecting the copper foil pattern, and the insulative protecting film and the copper foil pattern are bonded with each other by an insulative protecting film adhesive layer. On the exposed end portion of the copper foil pattern on one surface is formed a plated layer to be connected to an electrical component. The thickness of the insulative protecting film which is bonded with the surface on which the plated layer is formed is set to be thinner than the base polymer film. As a result, it is ensured that insulation failure of the insulative protecting film is prevented, and wire breakage of wiring when bent can easily be prevented.

Flexible wiring board and electrical device using the same

A semiconductor device includes a semiconductor substrate, a plurality of electrode pads aligned on the semiconductor substrate, and a plurality of bump electrodes placed on each electrode pad, wherein the plurality of bump electrodes on the electrode pad are aligned in a direction orthogonal to a direction where the electrode pads are aligned. A manufacturing method of the semiconductor device includes the steps of patterning a photoresist which serves as a bump electrode forming use mask on the semiconductor substrate having formed thereon the electrode pads and forming a bump electrode in a perpendicular straight wall shape to be thinner than the photoresist by plating the bump electrode forming use metal to the electrode pad.

Liquid crystal display device and/or circuit substrate including bump electrodes and electrode pads

Semiconductor device with bumps on electrode pads oriented in given direction

Semiconductor device including bump electrodes

A liquid crystal display device according to the present invention includes a substrate provided with a line pattern, and a circuit element electrically connected to the line pattern via a conductive layer. The line pattern has at least one bonding pad. The circuit element has at least one electrode pad. The at least one electrode pad has a plurality of bump electrodes provided thereon. The at least one electrode pad is electrically connected to the at least one bonding pad via the conductive layer which is provided between the plurality of bump electrodes and the bonding pad facing the plurality of bump electrodes, where the conductive layer is an insulative material having conductive particles dispersed throughout.

Liquid crystal display device including plural bump electrodes

A forced compression type pump including a cylindrically shaped pump case, an eccentric rotating body shaft-supported on said pump case at an eccentric position relative to said pump case and a compressing and forcibly sending member movable in a radial direction or said eccentric rotating body and adapted to be brought into press contact with the interior wall of said pump case, characterized in that the interior space is formed at the central part of said eccentric rotating body, a plurality of guide grooves are formed in a radial direction from said interior space to the circumferential surface of said eccentric rotating body, a plurality of circumferentially contacting cylindrical body inserted in said guide grooves and movable freely in a radial direction are formed, said plurality of circumferential contacting cylindrical body are in a planetary relationship relative to said central cylindrical body and the outer circumferential surfaces of said circumferentially contacting bodies are brought into press contact with the interior wall of said pump case while the circumferential surfaces of said circumferentially contacting bodies on their center sides are brought into press contact with said central cylindrical body, whereby said circumferentially contacting bodies are made to act as compressing and forcibly sending members.

Forced compression type pump

A display board has wirings on a surface thereof for transmitting a signal received from outside at a peripheral portion of the display board to a display area of the display board. Each wiring has a first conductive film formed of a first material and disposed on the surface of the display board, a second conductive film which is formed of a second material satisfying a condition that a surface of the second conductive film is less prone to oxidation than a surface of the first conductive film and which is disposed on a part of the first conductive film, and a transparent conductive film which is an oxide film and which is disposed on at least the second conductive film. Those first conductive film, second conductive film and transparent film constitute a three-layered structure portion of the wiring.

Display board having wiring with three-layered structure and a display

An electrode wiring on a mounting substrate adapted for use in liquid crystal display apparatus, the electrode wiring including portions of Mo or Mo alloy to which bumps of an integrated circuit such as LSI is bonded with conductive paste.

Liquid crystal display apparatus including an electrode wiring having

Electrodes on a mounting substrate and a liquid crystal display

To simplify a data reading apparatus for two-dimensional code data, a line sensor detection unit (30) for reading two-dimensional data includes an optical fiber band cable (3) bundling multiple optical fibers (31) of specified diameter in a band, and an upper end of the fibers is connected to a line sensor element (2) unit incorporated in the reading apparatus (S), and a lower end of the fibers is disposed opposite to an opening (11) of a specified size in the region of one or more two-dimensional code data in the bottom of the reading apparatus (S). The line sensor detection unit (3) including the optical fiber band cable (3) is disposed reciprocally parallel along the surface to be detected in an orthogonal direction, and the line sensor detection unit (30) is set movable within the range of the opening (11). A detection unit moving device (4) is disposed so as to read the two-dimensional code data. As a result, recorded two-dimensional code data can be read by a line sensor for reading one-dimensional data, so that high reading precision can be maintained and the product cost of the reading apparatus of the two-dimensional data can be reduced.

Two dimensional code data reading apparatus and method

A system and method for locating and reading digital data in data regions within a data field disposed on a surface of an object to be identified include the capability of compensating for optical or physical distortions of the data field as viewed by an optical reader. The data field is defined by X-axis and Y-axis intersecting basic lines disposed at a predetermined angle with respect to each other and a corner mark disposed on the opposite side of the data field from those basic lines. A plurality of positions marks for marking predetermined distances between a plurality of imaginary X and Y axis internal lines are also provided. The positions of the imaginary X-axis internal lines within the data field are determinable from their spacings and angles with respect to the Y-axis basic line. The positions of the imaginary Y-axis internal lines are determinable from their spacings and their angles with respect to the X-axis basic line. The location of the points of intersection of the imaginary X and Y axis internal lines are calculated in order to define data regions within the data field. The system and method compensate for optical and physical distortions of the locations of the X and Y axis basic lines, corner mark and position marks at the time of reading the data in order to accurately locate positions of the data regions within the data field.

Digital data reader of digital data recording sheet

A method for decoding and processing at high speed by reading two-dimensional code symbol marks by a code reader in a small memory capacity. The X-axis side indication line 4 or Y-axis side indication line 5 in an information area 8 recording the code symbol mark 2 is read by the code reader 3, and division marks 7 recorded on the X-axis side indication line 4 or Y-axis side indication line 5 are detected. At every interval of dividing the division marks 7 in the Y-axis direction or X-axis direction by a specific integer value, the code mark 9 of the binary signal recorded in the information are 8 is sequentially read by the code reader 3 up to an end part of the Y-axis side indication line 5 or the X-axis side indication line 4 and the region formed in each square, of which one side is the interval of the division mark 7 is read by the code reader 3, or the length between the division codes divided by an integer value is processed, thereby decoding the code symbol mark 2.

Method of decoding a two-dimensional code symbol mark

An identification code sheet includes of codes of merchandise, a character string or a document etc. The sheet can be read by a sensor. The identification code sheet including a representation area defined by both a X-axis and a Y-axis intersecting mutually either orthogonally or skewedly and sub-areas of identification code printed in are representation area. The said representation area is divided into sixteen or more sub-areas, in each of which an identification code of encoded indicia is recorded. With the coding and method much more informations relative to the conventional techniques may be handled and more particularly much more Kana-Kanzi, Arabic and Chinese letters etc. as well as numerical characters, symbols, and alphabets may be represented which can be easily read. The representation of repredentation areas defined by both the X-axis and the Y-axis and the identification code in said sub-areas ensures accuracy and speed of reading by means of a sensor to read the identification code sheet in any direction and further a simplier reading, representation and outputting etc. by use of a printing sheet and printing means for general use.

Method of reading identification code sheets using borders to determine

An identification code sheet for representing codes for merchandise, or the like and a method for reading the identification code sheet. The identification code sheet for identification of merchandise or the like, according to the invention, comprises a representation area defined by both a X-axis and a Y-axis intersecting mutually either orthgonally a skewedly and sub-area of identification code printed in said representation area. According to the invention, said representation area is divided into sixteen or more sub-areas, in each of which an identificiation code of signal codes of binary type is recorded. In this manner, more information may be stored compared to conventional techniques and more particularly more Kana-Kanzi, Arabic and Chinese letters etc. as well as numerical characters, symbols, and alphabets may be represented and easily read. Further, the representation of the representation area defined by both the X-axis and the Y-axis and the identification code in said sub-areas ensures accuracy and speed of reading by means of a sensor to read the identification code sheet in any direction and further a simpler reading, representation and outputting by use of a printing sheet and printing means for general use, is achievable.

Identification code

Growing community of inventors

Osaka, Japan

Hirokazu Yoshida