Hiratsuka, Japan

Hirokazu Shiroishi


Average Co-Inventor Count = 3.6

ph-index = 6

Forward Citations = 469(Granted Patents)


Location History:

  • Tokyo, JP (1993 - 1994)
  • Hiratsuka, JP (1990 - 1997)

Company Filing History:


Years Active: 1990-1997

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6 patents (USPTO):Explore Patents

Title: **The Innovations of Hirokazu Shiroishi**

Introduction

Hirokazu Shiroishi, an accomplished inventor based in Hiratsuka, Japan, has made significant contributions to the field of electronics through his innovative patented technologies. With six patents to his name, Shiroishi has focused primarily on soldering technologies that enhance the manufacturing processes of printed circuit boards.

Latest Patents

Among his latest innovations are two noteworthy patents related to solder compositions and methods for mounting. The first patent pertains to a solder-precipitating composition, which aims to optimize the formation of solder layers on circuit boards. The second patent details a method for manufacturing a solder-coated printed circuit board. This innovative method involves forming multiple pads on the circuit board at a pitch of 0.5 mm or less. The design ensures that the height and width of the pads follow essential relationships, allowing for effective solder application. Specifically, the width of each pad at the ends of the pad array is larger than that of the pads located in-between, while also ensuring that the pad width and distance between pads conform to specific dimensional relationships.

Career Highlights

Hirokazu Shiroishi has garnered valuable experience working with prominent companies in the industry. Notably, he has been associated with the Furukawa Electric Company and Harima Chemicals Incorporated, where he contributed to advancing technology in soldering materials and methods. His work has not only improved efficiency in electronic manufacturing but has also paved the way for further innovations in the field.

Collaborations

Throughout his career, Shiroishi has collaborated with esteemed colleagues including Kenichi Fuse and Takao Fukunaga. These partnerships have enriched his projects and enhanced collaborative innovation, allowing for a sharing of ideas and technologies that drive the industry forward.

Conclusion

Hirokazu Shiroishi’s impactful patents and professional contributions continue to shape the landscape of electronics manufacturing. His dedication to innovation propels advancements in solder technology and provides foundational support for future developments. Shiroishi stands as a prominent figure among today's inventors, demonstrating the power of creativity and engineering in the pursuit of excellence.

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