The Furukawa Electric Co., Ltd.

Harima Chemicals, Incorporated

Fujitsu Corporation

Stanley Electric Co., Ltd

Hirokazu Shiroishi

Kenichi Fuse

Takao Fukunaga

Kenzo Kobayashi

Masato Ono

Toshiyuki Kondo

Toshiaki Amano

Takahiro Fujiwara

Yutaka Higashiguchi

Mitsuo Inagaki

Hisao Irie

Osamu Waki

Seishi Kumamoto

Hidehiro Mishiro

Hirotaka Kashiwabara

Izumi Kosuga

Masanao Kohno

Kazuhito Higasa

Noriko Katayama

Jun Nishihashi

Solder-precipitating composition and mounting method using the

A plurality of pads are formed on a circuit board body at a pitch of 0.5 mm or less. The pads are formed such that a projecting height H of a pad from the board body surface and a width W of the pad satisfy a relation 2H&lt;W, that a pad array is formed in which a width of each of the pads located at two ends of the pad array is larger than that of a pad located therebetween, and that the pad width W and a pad-to-pad distance D satisfy a relation W&gt;D. A solder layer, obtained by a substitution reaction between a powder of a metal having the highest ionization tendency among metals constituting the solder layer or a powder of an alloy thereof and a salt formed by bonding the other metal or metals in the solder layer to an organic acid, is formed on each pad.

Solder-coated printed circuit board and method of manufacturing the same

A ground conducting layer and an antenna element conducting layer are set at a predetermined position in a cavity of a molding die, and molten resin is injected into the cavity, thereby molding a resin-formed member in which said ground conducting layer and said antenna element conducting layer are integrated. As a result of this, there can provided an antenna module comprising a resin member formed by molding to be a predetermined shape, a sheet-like ground conducting layer adhered to one surface of the resin member, a sheet-like antenna element conducting layer adhered to another surface opposing to the one surface of said resin member, and a feeder for feeding electricity to the antenna element conducting layer.

P-type antenna module and method for manufacturing the same

A vehicle lamp is mounted on vehicles such as automobiles. The lamp has an inner chamber constructed by a lamp housing and a lens, respectively having long shapes. In the chamber, there is a long light source fixing face member on which plural light sources are fixed. All light sources or electric bulbs are neatly fitted to convex or concave guide portions. Circuit patterns are printed on an inner face of the housing. Terminals of the light sources come into contact with the circuit patterns. The housing is made of particular synthetic resin having a good heat conductivity, so that no heat is accumulated in the chamber.

Vehicle lamp

A molded circuit board is constructed by forming a plurality of resin moldings integrally with a circuit film including an insulating film and circuit pattern on the insulating film, spaced specified distances therebetween, on one side of the circuit film. The plurality of moldings can be assembled into an electronic device box by bending the intermediate portion, between the moldings, of the circuit film.

Molded circuit board

A molded circuit board formed by molding a resin substrate to one side of a circuit film made by forming a desired circuit pattern to an insulating film in a manner to form an integral body. In the circuit film, there are provided soldering pad regions for mounting surface-mounting parts in a surface of the circuit film opposite the other surface in contact with resin substrate and through-holes at locations of the circuit film where insert-mounting parts are mounted. In the resin substrate, holes for receiving insert-mounting parts are formed in the molding process at the locations corresponding to the through-holes of the circuit film.

Growing community of inventors

Hiratsuka, Japan

Hirokazu Shiroishi