The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 1990
Filed:
Feb. 15, 1989
Applicant:
Inventors:
Kenzo Kobayashi, Ichihara, JP;
Hirokazu Shiroishi, Hiratsuka, JP;
Assignee:
The Furukawa Electric Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361398 ;
Abstract
A molded circuit board is constructed by forming a plurality of resin moldings integrally with a circuit film including an insulating film and circuit pattern on the insulating film, spaced specified distances therebetween, on one side of the circuit film. The plurality of moldings can be assembled into an electronic device box by bending the intermediate portion, between the moldings, of the circuit film.