Hiroji Noguchi

Title: Hiroji Noguchi: Innovator in Lead-Free Solder Alloys

Introduction

Hiroji Noguchi is a notable inventor based in Kadoma, Japan. He has made significant contributions to the field of solder materials, particularly in developing lead-free solder alloys. With a total of 4 patents to his name, Noguchi's work has had a substantial impact on the electronics industry.

Latest Patents

One of Noguchi's latest patents involves a lead-free solder alloy that features a relatively low melting temperature, making it suitable for soldering electronic devices. This alloy consists of 7 to 10 wt % of Zn, along with varying amounts of Ni, Ag, and Cu. Additionally, it may include Bi, In, and P, with the balance being Sn. Another lead-free solder alloy he developed contains 2 to 10 wt % of Zn, 10 to 30 wt % of Bi, and 0.05 to 2 wt % of Ag, also with Sn as the primary component. These solder alloys exhibit a tensile strength of at least 5 kgf/mm and a minimum elongation of 10%. Furthermore, he has patented a method for preparing solder powder and solder paste, which enhances soldering characteristics by suppressing the reaction of an activating component with an alloy component in a flux.

Career Highlights

Throughout his career, Hiroji Noguchi has worked with prominent companies, including Matsushita Electric Industrial Co., Ltd. His innovative approaches to solder materials have positioned him as a key figure in the development of environmentally friendly soldering solutions.

Collaborations

Noguchi has collaborated with notable individuals in the field, including Toshihiko Taguchi and Toshikazu Murata. Their combined expertise has contributed to advancements in solder technology.

Conclusion

Hiroji Noguchi's contributions to lead-free solder alloys and soldering methods highlight his role as an influential inventor in the electronics industry. His work not only addresses environmental concerns but also enhances the performance of electronic devices.