The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2002
Filed:
Dec. 28, 2000
Applicant:
Inventors:
Masahiko Hirata, Nara, JP;
Takashi Ohashi, Kyoto, JP;
Hisahiko Yoshida, Osaka, JP;
Hiroji Noguchi, Kyoto, JP;
Takao Hisazumi, Osaka, JP;
Mamoru Senna, Tokyo, JP;
Tetsuhiko Isobe, Kanagawa, JP;
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/02 ;
U.S. Cl.
CPC ...
B22F 1/02 ;
Abstract
An organic acid salt is deposited on the surface of a solder powder containing Sn and Zn. Alternatively, 0.5 to 10 wt. % of a nonionic surfactant is added to a flux. By a method comprising such a procedure, provided are a lead-free solder powder and solder paste having good soldering characteristics wherein the reaction of an activating component with an alloy component in a flux is suppressed.