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For the Inventor, By the Inventor

Komatsushima, Japan

Hirofumi Ichikawa

This inventor holds 18 USPTO granted patents and 5 EPO patents. Top assignee: Nichia Corporation. Active years: 2013-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hirofumi Ichikawa. Retrieved from https://idiyas.com/inventor/hirofumi-ichikawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18

% Patents Active = 100.0

 

Average Co-Inventor Count = 4.2

ph-index = 7

Forward Citations = 119(Granted Patents)


Location History:

  • Anan, JP (2013)
  • Tokushima, JP (2016 - 2018)
  • Komatsushima, JP (2013 - 2021)

Company Filing History:

goldMedal18 out of 3,251 
 
Nichia Corporation
 patents

Years Active: 2013-2025

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18 patents (USPTO):Explore Patents
1. 12507513 - Method for manufacturing light-emitting device, and light-emitting device (2025-12-23),
2. 12211959 - Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body (2025-01-28),
3. 11094854 - Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body (2021-08-17),
4. 10700241 - Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body (2020-06-30),
5. 10573789 - Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body (2020-02-25),
6. 10573788 - Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body (2020-02-25),
7. 10115870 - Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body (2018-10-30),
8. 9960326 - Light emitting device (2018-05-01),
9. 9893250 - Light emitting device having silicone resin-based sealing member (2018-02-13),
10. 9653662 - Light emitting device (2017-05-16),
11. 9559274 - Light emitting device and resin composition (2017-01-31),
12. 9537071 - Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body (2017-01-03),
13. 9490411 - Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body (2016-11-08),
14. 9472735 - Light-emitting device (2016-10-18),
15. 9397276 - Light emitting device and resin composition (2016-07-19),

Title: Hirofumi Ichikawa: Pioneering Inventor from Komatsushima

Introduction: Hirofumi Ichikawa is a renowned inventor hailing from Komatsushima, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Hirofumi Ichikawa holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: Throughout his illustrious career, Ichikawa has worked with leading tech companies to develop cutting-edge solutions that have revolutionized various industries. His innovative spirit and dedication to progress have earned him recognition on a global scale.

Collaborations: Hirofumi Ichikawa has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge-sharing that has led to the creation of impactful inventions with far-reaching implications.

Conclusion: Hirofumi Ichikawa's passion for pushing the boundaries of what is possible through innovation has solidified his reputation as a trailblazer in the world of technology, inspiring future generations to continue striving for excellence in the field of invention.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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