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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11094854 B1

PDFFull Text
Date of Patent:
Aug. 17, 2021

Filed:

May. 26, 2020

Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body

Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Hirofumi Ichikawa, Komatsushima, JP;

Masaki Hayashi, Anan, JP;

Shimpei Sasaoka, Tokushima, JP;

Tomohide Miki, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Caridad Everhart

Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 23/00 (2006.01); B29C 45/14 (2006.01); H01L 33/48 (2010.01); B29C 45/00 (2006.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); B29C 45/0055 (2013.01); B29C 45/14655 (2013.01); H01L 24/97 (2013.01); H01L 33/0095 (2013.01); H01L 33/504 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/641 (2013.01); B29C 2793/009 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2924/00012 (2013.01); H01L 2924/12035 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3025 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

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