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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12211959 B1

PDFFull Text
Date of Patent:
Jan. 28, 2025

Filed:

Jul. 09, 2021

Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body

Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Hirofumi Ichikawa, Komatsushima, JP;

Masaki Hayashi, Anan, JP;

Shimpei Sasaoka, Tokushima, JP;

Tomohide Miki, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Walter H Swanson

Assistant Examiner:

Moataz Khalifa

Int. Cl.
CPC ...
H01L 33/48 (2010.01); B29C 45/00 (2006.01); B29C 45/14 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 33/00 (2010.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); B29C 45/0055 (2013.01); B29C 45/14655 (2013.01); H01L 24/97 (2013.01); H01L 33/0095 (2013.01); H01L 33/504 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/641 (2013.01); B29C 2793/009 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2924/00012 (2013.01); H01L 2924/12035 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3025 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A light emitting device includes: a resin package including: a resin part, and a plurality of leads including a first lead and a second lead, wherein the resin package has a concave portion having a bottom face at which a part of an upper surface of the first lead and a part of an upper surface of the second lead are exposed from the resin part; a light emitting element mounted on the bottom face of the concave portion; and a sealing member covering the light emitting element in the concave portion. The plurality of leads comprise a plurality of notch parts including a first notch part on a first side corresponding to a first outer side surface of the resin package and a second notch part on a second side corresponding to a second outer side surface of the resin package.

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