This inventor holds 2 USPTO granted patents and 1 published patent application and 1 EPO patent. Top assignee: Sumitomo Metal Mining Company, Ltd.. Active years: 2015-2020.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2015-2020
Title: **Hiroaki Nagata: Innovator in Solder Alloy Technologies**
Introduction
Hiroaki Nagata is a prominent inventor based in Tokyo, Japan, known for his significant contributions to the field of solder alloy technologies. With a total of two patents to his name, Nagata's work focuses on enhancing the performance and reliability of electronic components through innovative materials.
Latest Patents
Nagata's most recent patents include the development of an Au–Sn–Ag-based solder alloy and solder material, specifically designed for high-temperature applications. This innovative alloy features a composition that ensures its solidus temperature ranges between 280 to 400°C, with a narrow gap of 40°C between the solidus and liquidus temperatures. The properties of the Au–Sn–Ag-based solder alloy provide low costs, superior solderability, and exceptional reflow wettability. These qualities make it particularly useful for reflow bonding applications, such as crystal quartz devices, SAW filters, and MEMS. Additionally, Nagata has developed a high-temperature Pb-free solder alloy that demonstrates the strength needed to connect electronic parts to substrates, boasting excellent wettability and workability. This solder alloy includes specific percentages of zinc, copper, phosphorus, and bismuth, which, along with possible aluminum content, enhance its effectiveness in electronic applications.
Career Highlights
Hiroaki Nagata is associated with the Sumitomo Metal Mining Company, Ltd., where he continues to innovate in the field of materials science. His dedication to improving solder materials has made a substantial impact on the electronics industry, contributing to higher-quality manufacturing processes and product longevity.
Collaborations
In his professional journey, Nagata has worked alongside esteemed colleagues Eiji Murase and Toshikazu Shimizu. These collaborations reflect a team-oriented approach toward innovation within the companies they have been involved in, further fostering advancements in solder technology.
Conclusion
Hiroaki Nagata is a leading figure in the development of advanced solder alloys, with his patents showcasing a deep understanding of materials science. His work at Sumitomo Metal Mining Company, Ltd., combined with productive partnerships, underscores his influential role in enhancing electronic component manufacturing and reliability.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile