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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10589387 B1

PDFFull Text
Date of Patent:
Mar. 17, 2020

Filed:

Aug. 27, 2015

Au—sn—ag-based solder alloy and solder material, electronic component sealed with the same au—sn—ag based solder alloy or solder material, and electronic component mounting device

Applicant:

Sumitomo Metal Mining Co., Ltd., Tokyo, JP;

Inventors:

Hiroaki Nagata, Tokyo, JP;

Eiji Murase, Tokyo, JP;

Toshikazu Shimizu, Tokyo, JP;

Assignee:

SUMITOMO METAL MINING CO., LTD., Tokyo, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

Anthony J Zimmer

Assistant Examiner:

Ricardo D Morales

Int. Cl.
CPC ...
B23K 35/30 (2006.01); C22C 5/02 (2006.01); H05K 3/34 (2006.01); C22C 1/02 (2006.01); B23K 101/36 (2006.01);
U.S. Cl.
CPC ...
B23K 35/3013 (2013.01); B23K 35/30 (2013.01); C22C 1/02 (2013.01); C22C 5/02 (2013.01); H05K 3/34 (2013.01); H05K 3/3457 (2013.01); B23K 2101/36 (2018.08);
Abstract

An Au—Sn—Ag-based solder alloy for high temperature use containing Sn, Ag, Au and elements that are inevitably contained owing to manufacture procedure, wherein the Au—Sn—Ag-based solder alloy has a composition adjusted so that a solidus temperature is within a range of 280 to 400° C. with a gap between the solidus temperature and the liquidus temperature being within 40° C. The Au—Ag—Sn-based solder alloy has low cost, and is excellent in solderability, reflow wettability and reliability. The excellent reflow wettability of the Au—Ag—Sn-based solder alloy allows it to be useful in reflow bonding of crystal quartz devices, SAW filters and MEMS.

Find Patent Forward Citations

Nagata, Hiroaki. (2020). Au—sn—ag-based solder alloy and solder material, electronic component sealed with the same au—sn—ag based solder alloy or solder material, and electronic component mounting device (U.S. Patent No. 10589387). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10589387

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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