The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2015
Filed:
Jun. 15, 2011
Hiroaki Nagata, Tokyo, JP;
Takashi Iseki, Tokyo, JP;
Jiro Taguchi, Niihama, JP;
Masato Takamori, Tokyo, JP;
Hiroaki Nagata, Tokyo, JP;
Takashi Iseki, Tokyo, JP;
Jiro Taguchi, Niihama, JP;
Masato Takamori, Tokyo, JP;
SUMITOMO METAL MINING CO., LTD., Tokyo, JP;
Abstract
Disclosed herein is a high-temperature Pb-free solder alloy having the strength required to join electronic parts to a substrate and having excellence in wettability and workability. The high-temperature Pb-free solder alloy contains 0.4% by mass or more but 13.5% by mass or less of Zn, 0.05% by mass or more but 2.0% by mass or less of Cu, 0.500% by mass or less of P, and a balance being Bi except for inevitable impurities. The Pb-free solder alloy may further contain 0.03% by mass or more but 0.7% by mass or less of Al.