Osaka, Japan

Hiroaki Machitani

USPTO Granted Patents = 4 

Average Co-Inventor Count = 3.6

ph-index = 1


Company Filing History:


Years Active: 2022-2025

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4 patents (USPTO):Explore Patents

Title: Hiroaki Machitani: Innovator in Wiring Circuit Board Technology

Introduction

Hiroaki Machitani is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of wiring circuit board technology, holding a total of four patents. His innovative designs have advanced the functionality and efficiency of electronic components.

Latest Patents

One of Machitani's latest patents is a wiring circuit board that includes two insulating layers, a wiring layer, a pad portion, and a conductive connection portion. The wiring layer is positioned on one side in the thickness direction of the first insulating layer and features a contact portion. The second insulating layer covers the wiring layer and has a through opening portion that aligns with the pad portion. This design allows for effective electrical connections between the wiring layer and the pad portion. Another notable patent involves a wired circuit board that consists of a metal supporting layer, an insulating base layer, and a conductor layer. The insulating base layer extends outward relative to the metal supporting layer, enhancing the overall structure and functionality of the circuit board.

Career Highlights

Hiroaki Machitani is currently employed at Nitto Denko Corporation, where he continues to innovate and develop advanced technologies in the field of electronics. His work has been instrumental in improving the performance and reliability of wiring circuit boards.

Collaborations

Machitani collaborates with talented coworkers, including Hayato Takakura and Yasunari Oyabu. Their combined expertise contributes to the success of their projects and the advancement of technology at Nitto Denko Corporation.

Conclusion

Hiroaki Machitani's contributions to wiring circuit board technology exemplify his innovative spirit and dedication to advancing electronic components. His patents reflect a commitment to enhancing functionality and efficiency in the industry.

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